DOSILICON CO., LTD. — Investor Relations & Filings
DOSILICON CO., LTD. is a fabless enterprise specializing in the design, development, and sales of high-performance memory chips. The company's product portfolio primarily includes SLC NAND Flash, NOR Flash, and DRAM solutions, such as DDR3 and LPDDR series. It also provides Multi-Chip Package (MCP) solutions that integrate multiple memory types into a single package. These products are engineered for low power consumption and high reliability, catering to diverse applications including Internet of Things (IoT) devices, consumer electronics, industrial automation, telecommunications infrastructure, and automotive systems. The company focuses on independent research and development to provide scalable memory storage solutions designed to meet the technical requirements of modern embedded systems and smart hardware.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2023年度内部控制评价报告 | 2024-04-19 | Chinese | |
| 第二届监事会第十一次会议决议公告 | 2024-04-19 | Chinese | |
| 东芯半导体股份有限公司募集资金使用管理办法 | 2024-04-19 | Chinese | |
| 东芯半导体股份有限公司信息披露管理制度 | 2024-04-19 | Chinese | |
| 2023年年度报告 | 2024-04-19 | Chinese | |
| 关于公司董事、监事、高级管理人员2023年度薪酬确认与2024年度薪酬方案的公告 | 2024-04-19 | Chinese |
Browse filings by year
6 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 44566177 | 2023年度内部控制评价报告 | 2024-04-19 | Chinese | ||
| 44566166 | 第二届监事会第十一次会议决议公告 | 2024-04-19 | Chinese | ||
| 44566153 | 东芯半导体股份有限公司募集资金使用管理办法 | 2024-04-19 | Chinese | ||
| 44566141 | 东芯半导体股份有限公司信息披露管理制度 | 2024-04-19 | Chinese | ||
| 44566111 | 2023年年度报告 | 2024-04-19 | Chinese | ||
| 44566110 | 关于公司董事、监事、高级管理人员2023年度薪酬确认与2024年度薪酬方案的公告 | 2024-04-19 | Chinese | ||
| 44566094 | 东芯半导体股份有限公司对外担保管理办法 | 2024-04-19 | Chinese | ||
| 44566085 | 2024年限制性股票激励计划实施考核管理办法 | 2024-04-19 | Chinese | ||
| 44566077 | 第二届董事会第十二次会议决议公告 | 2024-04-19 | Chinese | ||
| 44566056 | 2023年度环境、社会和治理(ESG)报告 | 2024-04-19 | Chinese | ||
| 44565814 | 东芯半导体股份有限公司章程 | 2024-04-19 | Chinese | ||
| 44565806 | 东芯半导体股份有限公司规范与关联方资金往来管理制度 | 2024-04-19 | Chinese | ||
| 44565797 | 关于2023年度计提资产减值准备的公告 | 2024-04-19 | Chinese | ||
| 44565786 | 东芯半导体股份有限公司关联交易管理制度 | 2024-04-19 | Chinese | ||
| 44565772 | 关于2024年度对外担保额度预计的公告 | 2024-04-19 | Chinese | ||
Market data
Market data not available
Price history
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DOSILICON CO., LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58154/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58154 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58154 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58154 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58154}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for DOSILICON CO., LTD. (id: 58154)"
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