
WINPAC INC. — Investor Relations & Filings
WINPAC INC. is a semiconductor company that specializes in back-end processing. As an Outsourced Semiconductor Assembly and Test (OSAT) provider, it offers a comprehensive range of services, including full-spectrum packaging and testing for various semiconductor products. The company's expertise covers integrated circuits (ICs) and memory chips such as dynamic random access memory (DRAM). WINPAC provides a total solution for the final stages of the semiconductor manufacturing process, from assembly to final product testing.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 주권매매거래정지해제 (액면병합 주권 변경상장) | 2026-05-15 | Korean | |
| 분기보고서 (2026.03) | 2026-05-15 | Korean | |
| 주권매매거래정지 (주식의 병합, 분할 등 전자등록 변경, 말소) | 2026-04-21 | Korean | |
| 정기주주총회결과 | 2026-03-27 | Korean | |
| 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-27 | Korean | |
| 사업보고서 (2025.12) | 2026-03-19 | Korean |
Browse filings by year
9 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
14 filings
| |||||
| 46368032 | 주권매매거래정지해제 (액면병합 주권 변경상장) | 2026-05-15 | Korean | ||
| 46348947 | 분기보고서 (2026.03) | 2026-05-15 | Korean | ||
| 34697169 | 주권매매거래정지 (주식의 병합, 분할 등 전자등록 변경, 말소) | 2026-04-21 | Korean | ||
| 33055674 | 정기주주총회결과 | 2026-03-27 | Korean | ||
| 33055662 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-27 | Korean | ||
| 32981123 | 사업보고서 (2025.12) | 2026-03-19 | Korean | ||
| 32974049 | 감사보고서제출 | 2026-03-18 | Korean | ||
| 32936059 | 주주총회소집공고 | 2026-03-12 | Korean | ||
| 32936031 | 주주총회집중일개최사유신고 | 2026-03-12 | Korean | ||
| 32935976 | 의결권대리행사권유참고서류 | 2026-03-12 | Korean | ||
| 32935737 | 주주총회소집결의 | 2026-03-12 | Korean | ||
| 32935729 | 주식병합결정 | 2026-03-12 | Korean | ||
| 14750807 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 2026-02-06 | Korean | ||
| 13940093 | 신주인수권부사채(해외신주인수권부사채포함)발행후만기전사채취득 | 2026-02-02 | Korean | ||
|
2025
1 filing
| |||||
| 10213953 | 주주명부폐쇄기간또는기준일설정 | 2025-12-16 | Korean | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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GUANGZHOU FANGBANG ELECTRONICS CO.,LTD
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GUC
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Guizhou Space Appliance Co., Ltd.
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GUIZHOU ZHENHUA FENGGUANG SEMICONDUCTOR CO., LTD.
Specializes in high-reliability analog integrated circuits …
|
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|
Gujarat Poly Electronics Limited
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|
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WINPAC INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/16224/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=16224 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=16224 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=16224 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 16224}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for WINPAC INC. (id: 16224)"
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