
WINPAC INC. — Investor Relations & Filings
WINPAC INC. is a semiconductor company that specializes in back-end processing. As an Outsourced Semiconductor Assembly and Test (OSAT) provider, it offers a comprehensive range of services, including full-spectrum packaging and testing for various semiconductor products. The company's expertise covers integrated circuits (ICs) and memory chips such as dynamic random access memory (DRAM). WINPAC provides a total solution for the final stages of the semiconductor manufacturing process, from assembly to final product testing.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 주권매매거래정지해제 (액면병합 주권 변경상장) | 2026-05-15 | Korean | |
| 분기보고서 (2026.03) | 2026-05-15 | Korean | |
| 주권매매거래정지 (주식의 병합, 분할 등 전자등록 변경, 말소) | 2026-04-21 | Korean | |
| 정기주주총회결과 | 2026-03-27 | Korean | |
| 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-27 | Korean | |
| 사업보고서 (2025.12) | 2026-03-19 | Korean |
Browse filings by year
9 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
14 filings
| |||||
| 46368032 | 주권매매거래정지해제 (액면병합 주권 변경상장) | 2026-05-15 | Korean | ||
| 46348947 | 분기보고서 (2026.03) | 2026-05-15 | Korean | ||
| 34697169 | 주권매매거래정지 (주식의 병합, 분할 등 전자등록 변경, 말소) | 2026-04-21 | Korean | ||
| 33055674 | 정기주주총회결과 | 2026-03-27 | Korean | ||
| 33055662 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-27 | Korean | ||
| 32981123 | 사업보고서 (2025.12) | 2026-03-19 | Korean | ||
| 32974049 | 감사보고서제출 | 2026-03-18 | Korean | ||
| 32936059 | 주주총회소집공고 | 2026-03-12 | Korean | ||
| 32936031 | 주주총회집중일개최사유신고 | 2026-03-12 | Korean | ||
| 32935976 | 의결권대리행사권유참고서류 | 2026-03-12 | Korean | ||
| 32935737 | 주주총회소집결의 | 2026-03-12 | Korean | ||
| 32935729 | 주식병합결정 | 2026-03-12 | Korean | ||
| 14750807 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 2026-02-06 | Korean | ||
| 13940093 | 신주인수권부사채(해외신주인수권부사채포함)발행후만기전사채취득 | 2026-02-02 | Korean | ||
|
2025
1 filing
| |||||
| 10213953 | 주주명부폐쇄기간또는기준일설정 | 2025-12-16 | Korean | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Changsha Jingjia Microelectronics Co.,Ltd.
Develops high-performance GPUs, integrated circuits, and el…
|
300474 | CN | Manufacturing |
|
CHANG WAH
Provider of semiconductor packaging materials, equipment, a…
|
8070 | TW | Manufacturing |
|
Changzhou Aohong Electronics Co., Ltd.
Specializes in high-precision PCB manufacturing for automot…
|
605058 | CN | Manufacturing |
|
Changzhou Galaxy Century Microelectronics Co.,Ltd.
IDM specializing in discrete semiconductor devices and powe…
|
688689 | CN | Manufacturing |
|
Changzhou Zhongying Science & Technology Co., Ltd.
Produces high-frequency microwave copper-clad laminates and…
|
300936 | CN | Manufacturing |
|
CHAOZHOU THREE-CIRCLE (GROUP) CO.,LTD.
Develops and manufactures advanced electronic components an…
|
300408 | CN | Manufacturing |
|
CHEER TIME
Manufacturer of high-quality PCBs specializing in small-vol…
|
3229 | TW | Manufacturing |
|
CHEMTRONICSCo.,Ltd.
Develops electronic and chemical materials for the technolo…
|
089010 | KR | Manufacturing |
|
CHENGDU GUOGUANG ELECTRONICS COMPANY,LTD
Develops precision electronic components for aerospace, tel…
|
688776 | CN | Manufacturing |
|
Chengdu Hongming Electronics Co., Ltd.
Manufactures high-precision electronic components for aeros…
|
301682 | CN | Manufacturing |
WINPAC INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/16224/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=16224 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=16224 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=16224 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 16224}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for WINPAC INC. (id: 16224)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.