
Winbond Electronics Corporation — Investor Relations & Filings
Winbond Electronics Corporation is a global provider of integrated memory IC solutions, encompassing product design, research and development, wafer fabrication, and marketing. The company specializes in three primary business areas: DRAM products, NOR Flash, and memory IC manufacturing. Its core portfolio features Code Storage Flash Memory, Specialty DRAM, Mobile DRAM, and TrustME Secure Flash. These solutions are widely deployed in handheld devices, consumer electronics, computer peripherals, automotive systems, and industrial applications. Winbond emphasizes high-barrier, high-quality manufacturing to deliver performance-driven and secure storage solutions. By leveraging advanced semiconductor technology, the company supports the requirements of AI-driven applications and the Internet of Things (IoT), focusing on providing reliable, high-performance memory components for smart terminals and diverse electronic systems.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公告本公司115年第一季合併財務報告董事會 預計召開日期為115年5月5日 | 2026-04-27 | Chinese | |
| 本公司舉行115年第一季度法人說明會,將於會中就公司115年第一季度財務數字與營運概況做說明 | 2026-04-21 | Chinese | |
| 115年05月法人說明會簡報 | 2026-04-21 | Chinese | |
| 115年03月內部人持股異動(事後) | 2026-04-09 | Chinese | |
| 115年03月董事會成員及持股 | 2026-04-09 | Chinese | |
| 115年3月背書保證與資金貸與 | 2026-04-08 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 37379340 | 公告本公司115年第一季合併財務報告董事會 預計召開日期為115年5月5日 | 2026-04-27 | Chinese | ||
| 34721259 | 本公司舉行115年第一季度法人說明會,將於會中就公司115年第一季度財務數字與營運概況做說明 | 2026-04-21 | Chinese | ||
| 34727054 | 115年05月法人說明會簡報 | 2026-04-21 | Chinese | ||
| 33902394 | 115年03月內部人持股異動(事後) | 2026-04-09 | Chinese | ||
| 33902374 | 115年03月董事會成員及持股 | 2026-04-09 | Chinese | ||
| 33794966 | 115年3月背書保證與資金貸與 | 2026-04-08 | Chinese | ||
| 33794965 | 115年3月營業收入 | 2026-04-08 | Chinese | ||
| 33660928 | 115年04月內部人持股未轉讓(事前) | 2026-04-02 | Chinese | ||
| 33660924 | 115年04月內部人持股轉讓(事前) | 2026-04-02 | Chinese | ||
| 33660932 | 調整本公司海外第四次無擔保轉換公司債轉換價格 | 2026-04-02 | Chinese | ||
| 33660934 | 本公司董事會決議股東會召開日期、召集事由及停止過戶期間等 (補充公告) | 2026-03-25 | Chinese | ||
| 33660938 | 公告本公司海外第四次無擔保轉換公司債完成定價 | 2026-03-24 | Chinese | ||
| 33660940 | 公告股利配發基準日 | 2026-03-11 | Chinese | ||
| 33660949 | 115年02月內部人持股異動(事後) | 2026-03-10 | Chinese | ||
| 33660944 | 115年02月董事會成員及持股 | 2026-03-10 | Chinese | ||
Market data
Market data not available
Price history
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Winbond Electronics Corporation via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52017/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52017 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52017 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52017 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52017}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Winbond Electronics Corporation (id: 52017)"
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