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Winbond Electronics Corporation — Investor Relations & Filings

Ticker · 2344 ISIN · TW0002344009 LEI · 254900STBMBTLA91J410 TW Manufacturing
Filings indexed 1,955 across all filing types
Latest filing 2026-05-05 Regulatory Filings
Country TW Taiwan
Listing TW 2344

About Winbond Electronics Corporation

https://WWW.WINBOND.COM

Winbond Electronics Corporation is a global provider of integrated memory IC solutions, encompassing product design, research and development, wafer fabrication, and marketing. The company specializes in three primary business areas: DRAM products, NOR Flash, and memory IC manufacturing. Its core portfolio features Code Storage Flash Memory, Specialty DRAM, Mobile DRAM, and TrustME Secure Flash. These solutions are widely deployed in handheld devices, consumer electronics, computer peripherals, automotive systems, and industrial applications. Winbond emphasizes high-barrier, high-quality manufacturing to deliver performance-driven and secure storage solutions. By leveraging advanced semiconductor technology, the company supports the requirements of AI-driven applications and the Internet of Things (IoT), focusing on providing reliable, high-performance memory components for smart terminals and diverse electronic systems.

Recent filings

Filing Released Lang Actions
公告本公司研發主管異動
Regulatory Filings
2026-05-05 Chinese
115年第1季權益變動表
Regulatory Filings
2026-05-05 Chinese
115年第1季現金流量表
Regulatory Filings
2026-05-05 Chinese
115年第1季綜合損益表
Regulatory Filings
2026-05-05 Chinese
115年第1季資產負債表
Regulatory Filings
2026-05-05 Chinese
115年年報及股東會資料 — 2026_2344_20260529F02.pdf
Regulatory Filings
2026-04-28 Chinese

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