Unimicron Technology Corp. — Investor Relations & Filings

Unimicron Technology Corporation specializes in the development and high-volume production of Printed Circuit Boards (PCB) and Integrated Circuit (IC) carriers. Its core product lineup includes High-Density Interconnect (HDI) boards, Every Layer Interconnect (ELIC) PCBs, multilayer boards, and flexible/rigid-flex circuits. The company provides advanced IC carrier solutions, such as Flip Chip Ball Grid Array (FCBGA), Flip Chip Chip Scale Package (FCCSP), and coreless carriers, catering to high-precision packaging requirements. Furthermore, its portfolio extends to specialized connectors and capacitive touch panel technologies, including One Glass Solution (OGS) and electrochromic mirrors for automotive applications. Unimicron focuses on delivering high-density, miniaturized, and high-speed interconnect solutions for applications in communications, computing, and consumer hardware.