
UNIMICRON — Investor Relations & Filings
Unimicron Technology Corporation specializes in the development and high-volume production of Printed Circuit Boards (PCB) and Integrated Circuit (IC) carriers. Its core product lineup includes High-Density Interconnect (HDI) boards, Every Layer Interconnect (ELIC) PCBs, multilayer boards, and flexible/rigid-flex circuits. The company provides advanced IC carrier solutions, such as Flip Chip Ball Grid Array (FCBGA), Flip Chip Chip Scale Package (FCCSP), and coreless carriers, catering to high-precision packaging requirements. Furthermore, its portfolio extends to specialized connectors and capacitive touch panel technologies, including One Glass Solution (OGS) and electrochromic mirrors for automotive applications. Unimicron focuses on delivering high-density, miniaturized, and high-speed interconnect solutions for applications in communications, computing, and consumer hardware.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年第1季資產負債表 | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_3037_20260529FE2.pdf | 2026-04-28 | English | |
| 115年年報及股東會資料 — 2026_3037_20260529FE1.pdf | 2026-04-28 | English | |
| 115年年報及股東會資料 — 2026_3037_20260529F13.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_3037_20260529F02.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_3037_20260529F01.pdf | 2026-04-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 37949457 | 115年第1季資產負債表 | 2026-04-28 | Chinese | ||
| 37950343 | 115年年報及股東會資料 — 2026_3037_20260529FE2.pdf | 2026-04-28 | English | ||
| 37950316 | 115年年報及股東會資料 — 2026_3037_20260529FE1.pdf | 2026-04-28 | English | ||
| 37950284 | 115年年報及股東會資料 — 2026_3037_20260529F13.pdf | 2026-04-28 | Chinese | ||
| 37950216 | 115年年報及股東會資料 — 2026_3037_20260529F02.pdf | 2026-04-28 | Chinese | ||
| 37950547 | 115年年報及股東會資料 — 2026_3037_20260529F01.pdf | 2026-04-28 | Chinese | ||
| 37934409 | 公告本公司國內第一次無擔保轉換公司債115年第1季轉換 普通股之增資基準日 | 2026-04-28 | Chinese | ||
| 37909619 | 本公司董事會決議解除經理人競業禁止之限制 | 2026-04-28 | Chinese | ||
| 37911647 | 公告本公司董事會決議辦理限制員工權利新股收回 註銷減資事宜 | 2026-04-28 | Chinese | ||
| 37911757 | 公告本公司一一五年第一季財務報告 | 2026-04-28 | Chinese | ||
| 37400831 | 更正115年2月至115年3月之資金貸與資訊揭露明細表 | 2026-04-27 | Chinese | ||
| 37404563 | 公告欣興電子股份有限公司第一次無擔保轉換公司債 (簡稱:欣興一,代碼:30371)於櫃檯買賣市場交易達公布 注意交易資訊標準,故公布相關訊息,以利投資人區別瞭解。 | 2026-04-27 | Chinese | ||
| 34689779 | 公告本公司民國115年第一季財務報告董事會召開日期 | 2026-04-20 | Chinese | ||
| 34571890 | 本公司取得廠務工程之相關資料 | 2026-04-15 | Chinese | ||
| 34571893 | 本公司取得廠務工程之相關資料 | 2026-04-15 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
UNIMICRON via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52270/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52270 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52270 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52270 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52270}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for UNIMICRON (id: 52270)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.