
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 海通证券股份有限公司关于通富微电子股份有限公司2022年度开展外汇远期结售汇业务的核查意见 | 2022-03-29 | Chinese | |
| 年度募集资金使用情况专项说明 | 2022-03-29 | Chinese | |
| 监事会关于2022年股票期权激励计划激励对象名单的公示情况说明及核查意见 | 2022-03-23 | Chinese | |
| 北京大成律师事务所关于公司2022年股票期权激励计划之法律意见书 | 2022-03-13 | Chinese | |
| 股票期权激励计划激励对象名单 | 2022-03-13 | Chinese | |
| 股权激励计划自查表 | 2022-03-13 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 34958773 | 海通证券股份有限公司关于通富微电子股份有限公司2022年度开展外汇远期结售汇业务的核查意见 | 2022-03-29 | Chinese | ||
| 34958764 | 年度募集资金使用情况专项说明 | 2022-03-29 | Chinese | ||
| 34958752 | 监事会关于2022年股票期权激励计划激励对象名单的公示情况说明及核查意见 | 2022-03-23 | Chinese | ||
| 34958744 | 北京大成律师事务所关于公司2022年股票期权激励计划之法律意见书 | 2022-03-13 | Chinese | ||
| 34958730 | 股票期权激励计划激励对象名单 | 2022-03-13 | Chinese | ||
| 34958723 | 股权激励计划自查表 | 2022-03-13 | Chinese | ||
| 34958711 | 监事会关于相关事项发表的意见 | 2022-03-13 | Chinese | ||
| 34958705 | 关于非公开发行A股股票预案修订情况说明的公告 | 2022-03-13 | Chinese | ||
| 34958700 | 2022年股票期权激励计划(草案)摘要 | 2022-03-13 | Chinese | ||
| 34958689 | 第七届董事会第十一次会议决议公告 | 2022-03-13 | Chinese | ||
| 34958681 | 独立董事关于公开征集表决权的公告 | 2022-03-13 | Chinese | ||
| 34958671 | 2021年度非公开发行A股股票预案(修订稿) | 2022-03-13 | Chinese | ||
| 34958645 | 第七届监事会第九次会议决议公告 | 2022-03-13 | Chinese | ||
| 34958636 | 关于公司第七届董事会第十一次会议相关事项的独立意见 | 2022-03-13 | Chinese | ||
| 34958628 | 2022年股票期权激励计划(草案) | 2022-03-13 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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