TOKYO SEIMITSU CO., LTD.
Manufacturer of semiconductor production equipment and precision measuring instruments for high-tech industries.
7729 | T
Overview
Corporate Details
- ISIN(s):
- N/A
- LEI:
- Country:
- Japan
- Address:
- 八王子市石川町2968番地2
- Website:
- https://www.accretech.com/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
Tokyo Seimitsu Co., Ltd., operating under the brand name ACCRETECH, is a leading manufacturer specializing in two primary business segments: semiconductor production equipment and precision measuring instruments. The company's Semiconductor Manufacturing Equipment division provides a comprehensive suite of production systems for wafer manufacturing, test, assembly, and back-end processing, including probing machines, dicing machines, and CMP systems. The Precision Measuring Instrument division supplies a wide range of metrology solutions, from multi-purpose to in-line measuring systems, guided by the principle 'no measurement, no manufacturing' to support various high-tech industries.
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Filings
Date | Filing | Language | Size | Actions | |
---|---|---|---|---|---|
2025-06-27 04:00 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 26.3 KB | ||
2025-06-20 09:41 |
Governance Information
内部統制報告書-第102期(2024/04/01-2025/03/31)
|
Japanese | 24.5 KB | ||
2025-06-20 09:39 |
Registration Form
確認書
|
Japanese | 8.8 KB | ||
2025-06-20 09:37 |
Annual Report
有価証券報告書-第102期(2024/04/01-2025/03/31)
|
Japanese | 1.5 MB | ||
2024-11-05 06:13 |
Regulatory News Service
確認書
|
Japanese | 8.9 KB | ||
2024-11-05 06:08 |
Interim Report
半期報告書-第102期(2024/04/01-2025/03/31)
|
Japanese | 242.7 KB | ||
2024-09-11 08:00 |
Registration Form
有価証券届出書(参照方式)
|
Japanese | 136.8 KB | ||
2024-06-26 07:21 |
Regulatory News Service
臨時報告書
|
Japanese | 27.7 KB | ||
2024-06-24 05:05 |
Governance Information
内部統制報告書-第101期(2023/04/01-2024/03/31)
|
Japanese | 23.7 KB | ||
2024-06-24 05:03 |
Registration Form
確認書
|
Japanese | 8.8 KB | ||
2024-06-24 05:01 |
Annual Report
有価証券報告書-第101期(2023/04/01-2024/03/31)
|
Japanese | 1.4 MB | ||
2024-02-06 06:04 |
Report Publication Announcement
確認書
|
Japanese | 8.9 KB | ||
2024-02-06 06:02 |
Quarterly Report
四半期報告書-第101期第3四半期(2023/10/01-2023/12/31)
|
Japanese | 188.6 KB | ||
2024-02-06 05:30 |
Report Publication Announcement
確認書
|
Japanese | 8.9 KB | ||
2024-02-06 05:22 |
Quarterly Report
訂正四半期報告書-第101期第2四半期(2023/07/01-2023/09/30)
|
Japanese | 180.7 KB |
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Market Data
Market Data Not Available
Financials & KPIs
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Insider Transactions
Date | Insider Name | Position | Type | Shares | Value |
---|---|---|---|---|---|
No insider transactions recorded for this company. |