TOKYO SEIMITSU CO., LTD.
Manufactures semiconductor equipment and precision measuring instruments.
7729 | T
Overview
Corporate Details
- ISIN(s):
- JP3580200008
- LEI:
- Country:
- Japan
- Address:
- 八王子市石川町２９６８番地２
- Website:
- https://www.accretech.com/en/
- Sector:
- Manufacturing
Description
TOKYO SEIMITSU CO., LTD., operating under the brand name ACCRETECH, is a manufacturer specializing in two core business segments: semiconductor manufacturing equipment and precision measuring instruments. The semiconductor division provides production systems for wafer probing, dicing, grinding, and chemical mechanical planarization (CMP), primarily supporting the test and assembly stages of semiconductor fabrication. The metrology division offers a comprehensive range of precision measuring instruments, including systems for analyzing surface texture, roundness, and contours, as well as coordinate measuring machines. These products provide solutions for both multi-purpose and in-line measurement across various manufacturing sectors.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2022-06-21 09:03 |
内部統制報告書－第99期(令和3年4月1日－令和4年3月31日)
|
Japanese | ZIP • 23.8 KB | ||
| 2022-06-21 09:02 |
確認書
|
Japanese | ZIP • 9.0 KB | ||
| 2022-06-21 09:00 |
有価証券報告書－第99期(令和3年4月1日－令和4年3月31日)
|
Japanese | ZIP • 1.3 MB | ||
| 2022-02-04 07:00 |
四半期報告書－第99期第3四半期(令和3年10月1日－令和3年12月31日)
|
Japanese | ZIP • 201.3 KB | ||
| 2021-11-05 07:00 |
四半期報告書－第99期第2四半期(令和3年7月1日－令和3年9月30日)
|
Japanese | ZIP • 249.2 KB | ||
| 2021-08-06 08:03 |
四半期報告書－第99期第1四半期(令和3年4月1日－令和3年6月30日)
|
Japanese | ZIP • 182.1 KB | ||
| 2021-06-22 08:41 |
内部統制報告書－第98期(令和2年4月1日－令和3年3月31日)
|
Japanese | ZIP • 23.9 KB | ||
| 2021-06-22 08:40 |
確認書
|
Japanese | ZIP • 9.0 KB | ||
| 2021-06-22 08:39 |
有価証券報告書－第98期(令和2年4月1日－令和3年3月31日)
|
Japanese | ZIP • 1.2 MB | ||
| 2021-03-15 06:03 |
四半期報告書－第98期第3四半期(令和2年10月1日－令和2年12月31日)
|
Japanese | ZIP • 185.2 KB | ||
| 2020-11-11 08:00 |
四半期報告書－第98期第2四半期(令和2年7月1日－令和2年9月30日)
|
Japanese | ZIP • 235.5 KB | ||
| 2020-08-07 08:30 |
四半期報告書－第98期第1四半期(令和2年4月1日－令和2年6月30日)
|
Japanese | ZIP • 170.6 KB | ||
| 2020-06-29 03:12 |
有価証券報告書－第97期(平成31年4月1日－令和2年3月31日)
|
Japanese | ZIP • 1.2 MB | ||
| 2020-02-14 07:02 |
四半期報告書－第97期第3四半期(令和1年10月1日－令和1年12月31日)
|
Japanese | ZIP • 176.5 KB | ||
| 2019-11-13 02:05 |
四半期報告書－第97期第2四半期(2019/07/01－2019/09/30)
|
Japanese | ZIP • 229.5 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
