
TMH Inc. — Investor Relations & Filings
TMH Inc. provides comprehensive solutions for the semiconductor manufacturing sector, focusing on the sale, repair, and maintenance of equipment and components. The company's offerings are structured around two key pillars: Engineering Power and Platform Digitization. The Engineering Power division delivers services such as equipment parts maintenance, productivity improvement solutions, and extending the operational life of legacy equipment by supplying discontinued parts. The Platform Digitization division operates LAYLA, a B2B international e-commerce site that facilitates the global sourcing of semiconductor parts, and provides inventory sharing solutions for business continuity. By integrating its technical expertise with a digital platform, TMH offers total support for semiconductor factories, strengthening supply chains through enhanced procurement, logistics, and manufacturing services.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 有価証券届出書(組込方式) | 2026-04-17 | Japanese | |
| 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-04-10 | Japanese | |
| 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-03-06 | Japanese | |
| 確認書 | 2026-02-27 | Japanese | |
| 有価証券報告書-第14期(2024/12/01-2025/11/30) | 2026-02-27 | Japanese | |
| 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-02-03 | Japanese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
6 filings
| |||||
| 34653424 | 有価証券届出書(組込方式) | 2026-04-17 | Japanese | ||
| 33958349 | 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-04-10 | Japanese | ||
| 32905941 | 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-03-06 | Japanese | ||
| 32843360 | 確認書 | 2026-02-27 | Japanese | ||
| 32843356 | 有価証券報告書-第14期(2024/12/01-2025/11/30) | 2026-02-27 | Japanese | ||
| 14118180 | 自己株券買付状況報告書(法24条の6第1項に基づくもの) | 2026-02-03 | Japanese | ||
|
2025
5 filings
| |||||
| 7239828 | 確認書 | 2025-07-15 | Japanese | ||
| 7239830 | 半期報告書-第14期(2024/12/01-2025/11/30) | 2025-07-15 | Japanese | ||
| 7259075 | 臨時報告書 | 2025-06-13 | Japanese | ||
| 7275623 | 有価証券報告書-第13期(2023/12/01-2024/11/30) | 2025-02-28 | Japanese | ||
| 7288847 | 臨時報告書 | 2025-01-14 | Japanese | ||
|
2024
3 filings
| |||||
| 7294240 | 訂正有価証券届出書(新規公開時) | 2024-11-26 | Japanese | ||
| 7294917 | 訂正有価証券届出書(新規公開時) | 2024-11-18 | Japanese | ||
| 7303769 | 有価証券届出書(新規公開時) | 2024-10-31 | Japanese | ||
Market data
Market data not available
Price history
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TMH Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/14752/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=14752 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=14752 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=14752 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 14752}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TMH Inc. (id: 14752)"
Report missing filing
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