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Thinkon Semiconductor Jinzhou Corp. — Investor Relations & Filings

Ticker · 688233 ISIN · CNE100003RB1 Shanghai Stock Exchange Manufacturing
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Filings indexed 674 across all filing types
Latest filing 2025-03-26 Capital/Financing Update
Country CN China
Listing Shanghai Stock Exchange 688233

About Thinkon Semiconductor Jinzhou Corp.

https://en.thinkon-cn.com/

Thinkon Semiconductor Jinzhou Corp. specializes in the research, development, and manufacturing of high-purity silicon materials and precision components for semiconductor manufacturing equipment. The company primarily focuses on the production of large-diameter monocrystalline silicon products, including silicon electrodes and silicon rings used in plasma etching processes. These components are essential for maintaining plasma stability and ensuring wafer uniformity during integrated circuit fabrication. Thinkon provides high-purity silicon materials that meet the stringent requirements of advanced manufacturing nodes. Its product portfolio supports both original equipment manufacturers and fabrication facilities. By leveraging advanced crystal growth and precision machining technologies, the company produces large-scale silicon parts capable of withstanding harsh chemical environments, catering to the global demand for high-performance consumables.

Recent filings

Filing Released Lang Actions
锦州神工半导体股份有限公司关于提请股东大会授权董事会以简易程序向特定对象发行股票的公告
Capital/Financing Update Classification · 95% confidence The document is an announcement from a company regarding a proposal to the shareholders' meeting to authorize the board of directors to issue shares to specific investors through a simplified procedure. It details the authorization request, issuance conditions, pricing, use of proceeds, and related procedural matters. The document is not a financial report, earnings release, or management discussion, but rather a formal announcement about a capital raising activity involving issuance of new shares. It does not contain financial statements or detailed financial analysis but focuses on the capital issuance plan and shareholder authorization. Therefore, it fits the category of Capital/Financing Update (CAP). The document length is about 3108 characters, which is consistent with an announcement rather than a full report.
2025-03-26 Chinese
锦州神工半导体股份有限公司2024年度审计报告
Regulatory Filings
2025-03-26 Chinese
锦州神工半导体股份有限公司关于召开2024年年度股东大会的通知
AGM Information Classification · 100% confidence The document is a notice about the convening of the 2024 Annual General Meeting (AGM) of Jinzhou Shengong Semiconductor Co., Ltd. It details the date, voting methods, meeting agenda, and instructions for shareholders to attend and vote. It includes the agenda items such as approval of the 2024 annual report, board and supervisory reports, financial statements, profit distribution, auditor appointment, and remuneration plans. The document does not contain the actual annual report or financial statements but is an announcement about the AGM and the matters to be voted on. The document length is 3461 characters, which is relatively short and consistent with a meeting notice rather than a full report. Therefore, it fits the category of AGM Information (AGM-R).
2025-03-26 Chinese
锦州神工半导体股份有限公司关于2024年年度利润分配方案的公告
Notice of Dividend Amount Classification · 95% confidence The document is an announcement from a company regarding its 2024 annual profit distribution plan, detailing the cash dividend per share, total dividend amount, and related financial figures. It includes information about the board and supervisory committee approvals and mentions the upcoming shareholder meeting for approval. The document does not contain full financial statements or comprehensive financial performance data but focuses on the dividend distribution plan and related disclosures. This fits the definition of a Notice of Dividend Amount (DIV), which announces dividend amounts, payment dates, and details for shareholders. The document length is relatively short (2592 characters), and it is not a full annual report or interim report. Therefore, the appropriate classification is DIV with high confidence.
2025-03-26 Chinese
锦州神工半导体股份有限公司2025年度“提质增效重回报”行动方案
Management Reports Classification · 95% confidence The document is a detailed action plan for the year 2025 by 锦州神工半导体股份有限公司, focusing on improving company quality, investor returns, operational efficiency, governance, and investor communication. It includes strategic goals, financial performance summaries, dividend policies, share repurchase details, governance improvements, and investor relations activities. The document is comprehensive and forward-looking, outlining management's plans and policies rather than presenting actual financial statements or quarterly results. It is not a typical annual or interim financial report, nor is it a simple announcement or certification. The content aligns with a Management Report (MDA) as it explains business trends, management strategies, and outlook for the company in detail.
2025-03-26 Chinese
锦州神工半导体股份有限公司2024年度独立董事述职报告（张仁寿）
Board/Management Information Classification · 95% confidence The document is titled as an "Independent Director's Annual Report" for the year 2024 by Zhang Renshou of Jinzhou Shengong Semiconductor Co., Ltd. It details the independent director's duties, attendance at board and committee meetings, communication with management and shareholders, oversight of financial reporting, internal controls, and compliance with laws and regulations. The content is a narrative report on the independent director's activities and observations during the year, not a financial report or audit report itself. It is a governance-related document focusing on the independent director's role and performance, which aligns with Board/Management Information filings. The document length is 3630 characters, which is relatively short but contains substantive content about the director's duties and activities rather than just an announcement or certification. Therefore, the best fitting category is Board/Management Information (MANG).
2025-03-26 Chinese

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