THEIL — Investor Relations & Filings
Tong Hsing Electronic Industries, Ltd. specializes in the development and manufacture of custom semiconductor micro-module packaging and advanced ceramic substrates. Utilizing core competencies in thick and thin film technologies, the company provides high-reliability solutions including Direct Plated Copper (DPC) and Active Metal Brazing (AMB) substrates. Its service offerings encompass multi-chip module miniaturization, hybrid integrated circuits, and comprehensive wafer-level services such as testing, grinding, and reconstruction. Tong Hsing’s products are integral to high-growth sectors including wireless communications, automotive electronics, MEMS, image sensors, and medical devices. The company focuses on high-power applications, supporting electric vehicle systems, high-brightness LEDs, and aerospace components through advanced thermal management and precision circuit patterning.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 更正115年3月衍生性商品交易資訊 | 2026-05-21 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AI1.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202503_6271_AIA.pdf | 2026-05-06 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46717261 | 更正115年3月衍生性商品交易資訊 | 2026-05-21 | Chinese | ||
| 41726390 | 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | ||
| 41726365 | 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726340 | 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese | ||
| 41726301 | 114年第4季財務報告書 — 202504_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726262 | 114年第4季財務報告書 — 202503_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726237 | 114年第4季財務報告書 — 202503_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726202 | 114年第4季財務報告書 — 202502_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726186 | 114年第4季財務報告書 — 202502_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726154 | 114年第4季財務報告書 — 202501_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726132 | 114年第4季財務報告書 — 202501_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41459144 | 115年04月內部人持股異動(事後) | 2026-05-05 | Chinese | ||
| 41456819 | 115年04月董事會成員及持股 | 2026-05-05 | Chinese | ||
| 38033792 | 115年第1季財務報告書 — 202601_6271_AI1.pdf | 2026-04-28 | Chinese | ||
| 37974041 | 115年第1季海外子公司投資 | 2026-04-28 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Anfu CE LINK Limited
Develops and manufactures signal cables, docking stations, …
|
300787 | CN | Manufacturing |
|
Anhui Coreach Technology Co.,Ltd
Develops thermal management and EMI shielding solutions for…
|
002983 | CN | Manufacturing |
|
Anhui Tongfeng Electronics Company Limited
Manufactures capacitors, metallized films, and quartz reson…
|
600237 | CN | Manufacturing |
|
ANHUI XDLK MICROSYSTEM CORPORATION LIMITED
Develops and manufactures MEMS sensors and advanced microsy…
|
688582 | CN | Manufacturing |
|
AOI ELECTRONICS CO.,LTD.
Manufactures electronic components, semiconductors, and MEM…
|
6832 | JP | Manufacturing |
|
Aoshikang Technology Co. , Ltd
Manufactures high-precision PCBs and HDI boards for automot…
|
002913 | CN | Manufacturing |
|
AOT
Specializes in LED packaging, sensing components, and optoe…
|
3437 | TW | Manufacturing |
|
APACT Co., Ltd.
Provider of semiconductor packaging, testing, and inspectio…
|
200470 | KR | Manufacturing |
|
APAQ
Produces high-performance solid-state capacitors for AI ser…
|
6449 | TW | Manufacturing |
|
APCB INC.
Manufacturer of high-precision double-sided and multi-layer…
|
6108 | TW | Manufacturing |
THEIL via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52546/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52546 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52546 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52546 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52546}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for THEIL (id: 52546)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.