
THEIL — Investor Relations & Filings
Tong Hsing Electronic Industries, Ltd. specializes in the development and manufacture of custom semiconductor micro-module packaging and advanced ceramic substrates. Utilizing core competencies in thick and thin film technologies, the company provides high-reliability solutions including Direct Plated Copper (DPC) and Active Metal Brazing (AMB) substrates. Its service offerings encompass multi-chip module miniaturization, hybrid integrated circuits, and comprehensive wafer-level services such as testing, grinding, and reconstruction. Tong Hsing’s products are integral to high-growth sectors including wireless communications, automotive electronics, MEMS, image sensors, and medical devices. The company focuses on high-power applications, supporting electric vehicle systems, high-brightness LEDs, and aerospace components through advanced thermal management and precision circuit patterning.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 公告本公司資本公積發放現金基準日 | 2026-05-25 | Chinese | |
| 公告本公司115年股東常會重要決議事項 | 2026-05-25 | Chinese | |
| 更正115年3月衍生性商品交易資訊 | 2026-05-21 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | |
| 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 47023946 | 公告本公司資本公積發放現金基準日 | 2026-05-25 | Chinese | ||
| 47023901 | 公告本公司115年股東常會重要決議事項 | 2026-05-25 | Chinese | ||
| 46717261 | 更正115年3月衍生性商品交易資訊 | 2026-05-21 | Chinese | ||
| 41726390 | 114年第4季財務報告書 — 202504_6271_AIC.pdf | 2026-05-06 | Chinese | ||
| 41726365 | 114年第4季財務報告書 — 202504_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726340 | 114年第4季財務報告書 — 202504_6271_AI3.pdf | 2026-05-06 | Chinese | ||
| 41726301 | 114年第4季財務報告書 — 202504_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726262 | 114年第4季財務報告書 — 202503_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726237 | 114年第4季財務報告書 — 202503_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726202 | 114年第4季財務報告書 — 202502_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726186 | 114年第4季財務報告書 — 202502_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41726154 | 114年第4季財務報告書 — 202501_6271_AIA.pdf | 2026-05-06 | Chinese | ||
| 41726132 | 114年第4季財務報告書 — 202501_6271_AI1.pdf | 2026-05-06 | Chinese | ||
| 41459144 | 115年04月內部人持股異動(事後) | 2026-05-05 | Chinese | ||
| 41456819 | 115年04月董事會成員及持股 | 2026-05-05 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
China Display Optoelectronics Technology Holdings Limited
Manufactures and sells small-to-medium-sized Liquid Crystal…
|
334 | BM | Manufacturing |
|
China Electronics Huada Technology Company Limited
Designs, develops, and sells integrated circuit chips; a do…
|
85 | HK | Manufacturing |
|
CHINA MICRO SEMICON(SHENZHEN) LIMITED
Fabless designer of mixed-signal ICs and microcontrollers f…
|
688380 | CN | Manufacturing |
|
China Resources Microelectronics Limited
Integrated device manufacturer of power semiconductors, sen…
|
688396 | CN | Manufacturing |
|
China Shuifa Singyes New Materials Holdings Limited
Develops, manufactures, and sells advanced functional new m…
|
8073 | HK | Manufacturing |
|
China Silver Technology Holdings Limited
Manufactures and trades Printed Circuit Boards (PCBs) and g…
|
515 | HK | Manufacturing |
|
China Strategic Technology Group Limited
Technology group focused on Aerospace, Precision Manufactur…
|
1725 | HK | Manufacturing |
|
CHINA WAFER LEVEL CSP CO.,LTD.
Provides advanced semiconductor packaging and testing servi…
|
603005 | CN | Manufacturing |
|
CHINA ZHENHUA(GROUP) SCIENCE& TECHNOLOGY CO.,LTD
Develops high-reliability electronic components and ICs for…
|
000733 | CN | Manufacturing |
|
CHIN-POON
Manufactures printed circuit boards for automotive and cons…
|
2355 | TW | Manufacturing |
THEIL via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52546/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52546 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52546 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52546 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52546}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for THEIL (id: 52546)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.