
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于开展外汇衍生品套期保值业务的公告 | 2025-03-12 | Chinese | |
| 2024年度独立董事述职报告(张汉斌) | 2025-03-12 | Chinese | |
| 2024年度内部控制自我评价报告 | 2025-03-12 | Chinese | |
| 年度关联方资金占用专项审计报告 | 2025-03-12 | Chinese | |
| 2024年度募集资金存放与使用情况的专项报告 | 2025-03-12 | Chinese | |
| 关于开展外汇衍生品套期保值业务的可行性分析报告 | 2025-03-12 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
12 filings
| |||||
| 36789295 | 关于开展外汇衍生品套期保值业务的公告 | 2025-03-12 | Chinese | ||
| 36789285 | 2024年度独立董事述职报告(张汉斌) | 2025-03-12 | Chinese | ||
| 36789275 | 2024年度内部控制自我评价报告 | 2025-03-12 | Chinese | ||
| 36789273 | 年度关联方资金占用专项审计报告 | 2025-03-12 | Chinese | ||
| 36789212 | 2024年度募集资金存放与使用情况的专项报告 | 2025-03-12 | Chinese | ||
| 36789207 | 关于开展外汇衍生品套期保值业务的可行性分析报告 | 2025-03-12 | Chinese | ||
| 36789195 | 2024年可持续发展(暨ESG)报告 | 2025-03-12 | Chinese | ||
| 36789121 | 涉及财务公司关联交易的存款、贷款等金融业务的专项说明 | 2025-03-12 | Chinese | ||
| 36789100 | 关于召开2024年年度股东大会的通知 | 2025-03-12 | Chinese | ||
| 36789082 | 2024年度独立董事述职报告(于洪宇) | 2025-03-12 | Chinese | ||
| 36789076 | 关于同一控制下股东拟非公开协议转让公司股份暨权益变动的提示性公告 | 2025-01-16 | Chinese | ||
| 36789065 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2025-01-13 | Chinese | ||
|
2024
3 filings
| |||||
| 36789049 | 第四届董事会第四次会议决议 | 2024-12-27 | Chinese | ||
| 36789039 | 国泰君安证券股份有限公司、中航证券有限公司关于公司使用部分闲置募集资金进行现金管理的核查意见 | 2024-12-27 | Chinese | ||
| 36789025 | 关于使用部分闲置募集资金进行现金管理的公告 | 2024-12-27 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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