
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于使用部分闲置募集资金进行现金管理到期赎回并继续进行现金管理的公告 | 2018-06-26 | Chinese | |
| 关于收到董事长辞职报告的公告 | 2018-06-01 | Chinese | |
| 第二届董事会第四次会议决议公告 | 2018-06-01 | Chinese | |
| 独立董事关于公司董事长辞职的独立意见 | 2018-06-01 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理到期赎回并继续进行现金管理的公告 | 2018-05-29 | Chinese | |
| 2017年年度权益分派实施公告 | 2018-05-21 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2018
15 filings
| |||||
| 36770316 | 关于使用部分闲置募集资金进行现金管理到期赎回并继续进行现金管理的公告 | 2018-06-26 | Chinese | ||
| 36770305 | 关于收到董事长辞职报告的公告 | 2018-06-01 | Chinese | ||
| 36770296 | 第二届董事会第四次会议决议公告 | 2018-06-01 | Chinese | ||
| 36770289 | 独立董事关于公司董事长辞职的独立意见 | 2018-06-01 | Chinese | ||
| 36770275 | 关于使用部分闲置募集资金进行现金管理到期赎回并继续进行现金管理的公告 | 2018-05-29 | Chinese | ||
| 36770261 | 2017年年度权益分派实施公告 | 2018-05-21 | Chinese | ||
| 36770245 | 关于签署《金融服务框架协议》的公告 | 2018-04-27 | Chinese | ||
| 36770235 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2018-04-23 | Chinese | ||
| 36770226 | 2018年第一季度报告正文 | 2018-04-20 | Chinese | ||
| 36770215 | 2018年第一季度报告全文 | 2018-04-20 | Chinese | ||
| 36770200 | 2017年度股东大会决议公告 | 2018-04-02 | Chinese | ||
| 36770191 | 2017年度股东大会的法律意见书 | 2018-04-02 | Chinese | ||
| 36770180 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2018-03-30 | Chinese | ||
| 36770172 | 关于关联方归还上市公司非经营性占用资金的公告 | 2018-03-30 | Chinese | ||
| 36770160 | 关于注销部分募集资金账户的公告 | 2018-03-29 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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