
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于获得投资收益的公告 | 2020-12-21 | Chinese | |
| 关于合伙企业完成工商注销登记的公告 | 2020-12-15 | Chinese | |
| 独立董事关于第四届董事会第五次会议相关事项的独立意见 | 2020-12-10 | Chinese | |
| 关于控股子公司拟以募集资金投资项目部分资产开展融资租赁业务及公司为控股子公司开展融资租赁业务提供担保的公告 | 2020-12-10 | Chinese | |
| 第四届董事会第五次会议决议公告 | 2020-12-10 | Chinese | |
| 关于董事、高级管理人员减持计划的预披露公告 | 2020-12-10 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 37274284 | 关于获得投资收益的公告 | 2020-12-21 | Chinese | ||
| 37274271 | 关于合伙企业完成工商注销登记的公告 | 2020-12-15 | Chinese | ||
| 37274262 | 独立董事关于第四届董事会第五次会议相关事项的独立意见 | 2020-12-10 | Chinese | ||
| 37274253 | 关于控股子公司拟以募集资金投资项目部分资产开展融资租赁业务及公司为控股子公司开展融资租赁业务提供担保的公告 | 2020-12-10 | Chinese | ||
| 37274241 | 第四届董事会第五次会议决议公告 | 2020-12-10 | Chinese | ||
| 37274232 | 关于董事、高级管理人员减持计划的预披露公告 | 2020-12-10 | Chinese | ||
| 37274224 | 关于变更保荐机构后重新签订募集资金四方监管协议及注销部分募集资金专户的公告 | 2020-12-09 | Chinese | ||
| 37274223 | 关于控股子公司完成工商变更登记的公告 | 2020-12-07 | Chinese | ||
| 37274214 | 独立董事关于第四届董事会第四次会议相关事项的独立意见 | 2020-12-03 | Chinese | ||
| 37274202 | 关于全资子公司处置部分资产的公告 | 2020-12-03 | Chinese | ||
| 37274194 | 关于聘任首席运营官(半导体生产运营)的公告 | 2020-12-03 | Chinese | ||
| 37274187 | 第四届董事会第四次会议决议公告 | 2020-12-03 | Chinese | ||
| 37274178 | 第四届监事会第四次会议决议公告 | 2020-12-03 | Chinese | ||
| 37274168 | 关于控股股东、实际控制人减持计划实施完毕的公告 | 2020-11-30 | Chinese | ||
| 37274160 | 关于控股股东、实际控制人减持股份比例达到1%的公告 | 2020-11-24 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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