Renesas Electronics Corporation — Investor Relations & Filings
Renesas Electronics Corporation is a global semiconductor provider specializing in embedded design solutions. The company develops, manufactures, and sells a broad portfolio of products, including microcontrollers (MCUs), microprocessors (MPUs), System-on-Chips (SoCs), analog components, and power management integrated circuits. Renesas delivers these components as standalone products and as integrated "Winning Combinations" that combine processing, analog, power, and connectivity to simplify system development. Key target markets include the automotive, industrial, and Internet of Things (IoT) sectors, where its solutions enable applications such as advanced driver-assistance systems, factory automation, robotics, and smart home devices. The company focuses on providing trusted, innovative technologies for a secure and connected world.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 四半期報告書－第20期第3四半期(令和3年7月1日－令和3年9月30日) | 2021-11-11 | Japanese | |
| Scheme of Arrangement Becomes Effective | 2021-08-31 | English | |
| Update on Conditions and Timetable | 2021-08-16 | English | |
| 四半期報告書－第20期第2四半期(令和3年4月1日－令和3年6月30日) | 2021-08-04 | Japanese | |
| Update on Financing Arrangements | 2021-06-30 | English | |
| Update on Financing Arrangements | 2021-06-16 | English |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
12 filings
| |||||
| 7623998 | 四半期報告書－第20期第3四半期(令和3年7月1日－令和3年9月30日) | 2021-11-11 | Japanese | ||
| 11006912 | Scheme of Arrangement Becomes Effective | 2021-08-31 | English | ||
| 11004273 | Update on Conditions and Timetable | 2021-08-16 | English | ||
| 7662762 | 四半期報告書－第20期第2四半期(令和3年4月1日－令和3年6月30日) | 2021-08-04 | Japanese | ||
| 10993809 | Update on Financing Arrangements | 2021-06-30 | English | ||
| 10990580 | Update on Financing Arrangements | 2021-06-16 | English | ||
| 7671877 | 四半期報告書－第20期第1四半期(令和3年1月1日－令和3年3月31日) | 2021-05-14 | Japanese | ||
| 7673304 | 内部統制報告書－第19期(令和2年1月1日－令和2年12月31日) | 2021-03-31 | Japanese | ||
| 7673296 | 確認書 | 2021-03-31 | Japanese | ||
| 7673297 | 有価証券報告書－第19期(令和2年1月1日－令和2年12月31日) | 2021-03-31 | Japanese | ||
| 10968212 | Publication of Scheme Document | 2021-03-08 | English | ||
| 10960942 | Offer for Dialog Semiconductor plc | 2021-02-08 | English | ||
|
2020
3 filings
| |||||
| 7682554 | 四半期報告書－第19期第3四半期(令和2年7月1日－令和2年9月30日) | 2020-11-05 | Japanese | ||
| 7687221 | 四半期報告書－第19期第2四半期(令和2年4月1日－令和2年6月30日) | 2020-08-05 | Japanese | ||
| 7691112 | 四半期報告書－第19期第1四半期(令和2年1月1日－令和2年3月31日) | 2020-05-12 | Japanese | ||
Market data
Market data not available
Price history
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Renesas Electronics Corporation via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/12027/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=12027 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=12027 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=12027 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 12027}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Renesas Electronics Corporation (id: 12027)"
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