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Powerchip Semiconductor Manufacturing Corporation — Investor Relations & Filings

Ticker · 6770 ISIN · TW0006770001 LEI · 529900VFH8M98IALG693 TW Manufacturing
Open in API
Filings indexed 51 across all filing types
Latest filing 2026-05-11 Regulatory Filings
Country TW Taiwan
Listing TW 6770

About Powerchip Semiconductor Manufacturing Corporation

https://www.powerchip.com

Powerchip Semiconductor Manufacturing Corporation (PSMC) is a professional wafer foundry service provider that utilizes an Open Foundry operation model. The company specializes in the manufacturing of advanced memories, customized logic integrated circuits, and discrete components. Its core offerings include foundry services for DRAM, Flash memory, power management ICs, and CMOS image sensors. PSMC distinguishes itself through the integration of memory and logic technologies, facilitating the development of 3D AI foundry solutions and high-performance integrated circuits. The company provides a comprehensive suite of services encompassing design support, wafer manufacturing, and testing. Focused on production efficiency and technical innovation, PSMC delivers tailored solutions to meet the requirements of diverse global markets, emphasizing quality and the advancement of specialized process technologies.

Recent filings

Filing Released Lang Actions
公司基本資料
Regulatory Filings Classification · 82% confidence The document is a statutory corporate information listing from the Taiwan MOPS (“公開資訊觀測站”) detailing the company’s registration, directorship, capital, contact details, and other basic corporate data. It does not contain any financial results, meeting materials, or announcements of specific financing, dividends, or governance changes; it is a standard regulatory disclosure of static corporate details. Therefore, it should be classified as a general Regulatory Filings (RNS).
2026-05-11 Chinese
115年5月變更登記
Share Issue/Capital Change Classification · 85% confidence The document is a filing from the public information observation station detailing the company’s share capital structure: authorized capital, paid‐in capital, and sources of capital changes (e.g., employee stock warrant conversion). This is an announcement of capital structure changes, matching the definition of Share Issue/Capital Change.
2026-05-11 Chinese
115年第1季財務報告書 — 202601_6770_AIA.pdf
Regulatory Filings
2026-05-05 Chinese
115年第1季財務報告書 — 202601_6770_AI1.pdf
Regulatory Filings
2026-04-29 Chinese
115年第1季權益變動表
Interim / Quarterly Report Classification · 89% confidence The document is titled “合併權益變動表” (Consolidated Statement of Changes in Equity) for the first quarter of the fiscal year and includes detailed interim financial statement data (opening/closing balances, equity movements, Q1 vs prior year). It is an actual quarterly financial statement (not a mere announcement or summary). Therefore, it is classified as an Interim/Quarterly Report (IR). Q1 2026
2026-04-29 English
115年第1季現金流量表
Interim / Quarterly Report Classification · 85% confidence The document is a consolidated cash flow statement (“合併現金流量表”) for the first quarter of ROC year 115 (Jan 1–Mar 31), showing detailed operating, investing, and financing cash flows. It contains substantive financial statements for an interim period (Q1), indicating it is part of an interim/quarterly financial report rather than a mere announcement or summary. Therefore, it fits the Interim/Quarterly Report classification (IR). Q1 2026
2026-04-29 Chinese

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