
KINSUS — Investor Relations & Filings
Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年05月僑外投資持股 | 2026-05-25 | Chinese | |
| 本公司受邀參加華南永昌證券舉辦之投資論壇 | 2026-05-21 | Chinese | |
| 115年05月法人說明會簡報 — 318920260519M001.pdf | 2026-05-21 | English | |
| 115年05月法人說明會簡報 | 2026-05-21 | Chinese | |
| 公告本公司取得工程相關資訊 | 2026-05-14 | Chinese | |
| 115年第1季海外子公司投資 | 2026-05-12 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 47010089 | 115年05月僑外投資持股 | 2026-05-25 | Chinese | ||
| 46725301 | 本公司受邀參加華南永昌證券舉辦之投資論壇 | 2026-05-21 | Chinese | ||
| 46708731 | 115年05月法人說明會簡報 — 318920260519M001.pdf | 2026-05-21 | English | ||
| 46708703 | 115年05月法人說明會簡報 | 2026-05-21 | Chinese | ||
| 46374232 | 公告本公司取得工程相關資訊 | 2026-05-14 | Chinese | ||
| 46126227 | 115年第1季海外子公司投資 | 2026-05-12 | Chinese | ||
| 46125275 | 115年第1季大陸投資 | 2026-05-12 | Chinese | ||
| 45473996 | 115年第1季財務報告書 — 202601_3189_AI1.pdf | 2026-05-10 | Chinese | ||
| 45464979 | 115年第1季財務報告書 — 202601_3189_AIA.pdf | 2026-05-10 | English | ||
| 39869902 | 公告本公司115年第1季財務報告董事會召開日期為115年05月08日 | 2026-04-30 | Chinese | ||
| 36181149 | 115年年報及股東會資料 — 2026_3189_20260527FE2.pdf | 2026-04-24 | English | ||
| 36181120 | 115年年報及股東會資料 — 2026_3189_20260527FE1.pdf | 2026-04-24 | English | ||
| 36181103 | 115年年報及股東會資料 — 2026_3189_20260527F13.pdf | 2026-04-24 | Chinese | ||
| 36181086 | 115年年報及股東會資料 — 2026_3189_20260527F02.pdf | 2026-04-24 | Chinese | ||
| 36181047 | 115年年報及股東會資料 — 2026_3189_20260527F01.pdf | 2026-04-24 | Chinese | ||
Market data
Market data not available
Price history
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KINSUS via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52304/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52304 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52304 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52304 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52304}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for KINSUS (id: 52304)"
Report missing filing
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