Skip to main content
KINSUS logo

KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
Open in API
Filings indexed 2,550 across all filing types
Latest filing 2021-11-11 Regulatory Filings
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
110年第3季財務報告書 — 202103_3189_AIA.pdf
Regulatory Filings
2021-11-11 Chinese
110年第3季財務報告書 — 202103_3189_AI1.pdf
Regulatory Filings
2021-11-11 Chinese
110年第3季財務報告書 — 202102_3189_AIA.pdf
Interim / Quarterly Report Classification · 100% confidence The document is titled as "English Translation of Financial Statements and a Report Originally Issued in Chinese" for Kinsus Interconnect Technology Corp. It contains consolidated financial statements including balance sheets, statements of comprehensive income, changes in equity, cash flows, and extensive footnotes. The period covered includes June 30, 2021 and 2020, indicating a half-year period. The presence of an Independent Auditors' Review Report and detailed financial data confirms this is a financial report for a period shorter than a full fiscal year. The document length is substantial (15,000 characters), and it contains actual financial statements and analysis, not just an announcement or certification. Therefore, this document fits the definition of an Interim / Quarterly Report (IR). H1 2021
2021-11-11 Chinese
110年第3季財務報告書 — 202102_3189_AI1.pdf
Regulatory Filings
2021-11-11 Chinese
110年第3季財務報告書 — 202101_3189_AIA.pdf
Regulatory Filings
2021-11-11 Chinese
110年第3季財務報告書 — 202101_3189_AI1.pdf
Interim / Quarterly Report Classification · 95% confidence The document is titled as a "合併財務報告暨會計師核閱報告" which translates to "Consolidated Financial Report and Auditor's Review Report". It covers the period from January 1 to March 31 of the 110th year of the Republic of China calendar (which corresponds to 2021). The content includes consolidated financial statements such as balance sheets, income statements, cash flow statements, notes to financial statements, and auditor's review report. The length is about 15,000 characters, indicating a full report rather than a brief announcement. The presence of detailed financial data and auditor's review confirms this is an interim or quarterly financial report. Therefore, the document fits the definition of an Interim / Quarterly Report (IR). Q1 2021
2021-11-11 Chinese

Browse filings by year

14 years

Report missing filing

Can't find a specific document? Let us know and we'll add it within 24 hours.

We will notify you once the filing is added.
Report sent
Thank you. We will check the data and update it shortly.