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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
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Filings indexed 2,545 across all filing types
Latest filing 2023-06-09 Annual Report
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
112年年報及股東會資料 — 2022_3189_20230531FE4.pdf
Annual Report Classification · 100% confidence The document is titled 'KINSUS INTERCONNECT TECHNOLOGY CORP. 2022 Annual Report' and contains detailed sections typical of an annual report, including a business report to shareholders, company profile, corporate governance report, capital raising activities, overview of operations, financial status, and financial statements for the most recent fiscal year. It includes comprehensive financial data, analysis, and audit information. The length of the document (15,000 characters) and the detailed content confirm it is the full annual report, not just an announcement or summary. Therefore, the appropriate classification is 'Annual Report' with code 10-K. FY 2022
2023-06-09 Chinese
112年年報及股東會資料 — 2022_3189_20230531F04.pdf
Regulatory Filings
2023-06-09 Chinese
112年年報及股東會資料 — 2023_3189_20230531FE2.pdf
AGM Information Classification · 95% confidence The document is titled 'Handbook for the 2023 Annual Meeting of Shareholders' and includes detailed agenda items for the Annual General Meeting (AGM) of Kinsus Interconnect Technology Corp. It contains the meeting procedure, agenda, items to be reported and approved, including the 2022 Business Report, Audit Committee’s Review Report, financial statements, earnings distribution, and other shareholder meeting materials. The content is consistent with materials typically shared during an AGM, including business reports and financial statements as attachments, but the primary document is the meeting handbook and agenda, not the full annual report itself. The document length is about 15,000 characters, which is typical for AGM materials. Therefore, this document fits the category of AGM Information (AGM-R).
2023-06-09 Chinese
112年年報及股東會資料 — 2023_3189_20230531FE1.pdf
AGM Information Classification · 95% confidence The document is a meeting notice for the 2023 Annual Shareholders' Meeting of KINSUS INTERCONNECT TECHNOLOGY CORP. It includes details such as meeting time, venue, agenda items including reports and proposals to be approved, dividend distribution information, and instructions for shareholders on attendance and voting. The document does not contain the actual business report, financial statements, or detailed financial data but rather announces the meeting and its agenda. The length is 4504 characters, which is relatively short and consistent with a meeting notice rather than a full report. Therefore, this document fits the category of AGM Information (AGM-R), which covers presentations and materials shared during the Annual General Meeting, including notices and agendas.
2023-06-09 Chinese
112年年報及股東會資料 — 2023_3189_20230531F13.pdf
AGM Information Classification · 95% confidence The document is titled as reference materials for the 112th Annual General Meeting (AGM) of the company. It includes items for approval such as the 111th fiscal year business report, financial statements, and profit distribution plan. It mentions that the financial statements have been audited and reviewed by the audit committee, and references attachments within the meeting handbook. The content is clearly related to materials presented for shareholder approval at the AGM, not the full annual report itself. The document length is short (539 characters), consistent with meeting materials rather than a full report. Therefore, this document fits the category of AGM Information (AGM-R).
2023-06-09 Chinese
112年年報及股東會資料 — 2023_3189_20230531F02.pdf
AGM Information Classification · 95% confidence The document is titled as the "112年股東常會議事手冊" which translates to the "112th Annual General Meeting (AGM) Handbook" of Kinsus Interconnect Technology Corp. It contains detailed agenda items for the AGM, including reports on the 111年度營業報告書 (2022 Annual Business Report), the審計委員會審查報告書 (Audit Committee Review Report), the會計師查核報告及111年度財務報表 (Auditor's Report and 2022 Financial Statements), and盈餘分配表 (Earnings Distribution Table). The document includes the meeting procedures, reports, approvals, and attachments such as the annual business report and audit reports. The content is consistent with materials shared during an Annual General Meeting, including detailed reports and resolutions for shareholder approval. The document length is substantial (15,000 characters), indicating it is the meeting materials themselves, not just an announcement of a report. Therefore, the document fits the category of AGM Information (AGM-R).
2023-06-09 Chinese

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