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KINSUS — Investor Relations & Filings

Ticker · 3189 ISIN · TW0003189007 TW Manufacturing
Filings indexed 2,550 across all filing types
Latest filing 2017-11-15 Regulatory Filings
Country TW Taiwan
Listing TW 3189

About KINSUS

www.kinsus.com.tw

Kinsus Interconnect Technology Corp. specializes in the design, development, and manufacturing of integrated circuit (IC) substrates. The company provides a comprehensive range of advanced packaging solutions, including System-in-Package (SiP), Plastic Ball Grid Array (PBGA), Flip Chip Chip Scale Package (FCCSP), Chip Scale Package (CSP), RF modules, and Flip Chip Ball Grid Array (FCBGA). As a prominent global supplier of Flip Chip substrates, the company serves leading international IC design firms and occupies a strategic position within the AI supply chain. Its products are integral to high-speed computing and high-performance semiconductor applications. Kinsus leverages professional manufacturing technology and robust research and development capabilities to deliver high-precision interconnect solutions that meet the technical requirements of modern electronic components and advanced computing architectures.

Recent filings

Filing Released Lang Actions
106年第3季財務報告書 — 201703_3189_AIA.pdf
Regulatory Filings
2017-11-15 Chinese
106年第3季財務報告書 — 201703_3189_AI1.pdf
Regulatory Filings
2017-11-15 Chinese
106年第3季財務報告書 — 201702_3189_AIA.pdf
Regulatory Filings
2017-11-15 Chinese
106年第3季財務報告書 — 201702_3189_AI1.pdf
Regulatory Filings
2017-11-15 Chinese
106年第3季財務報告書 — 201701_3189_AIA.pdf
Regulatory Filings
2017-11-15 Chinese
106年第3季財務報告書 — 201701_3189_AI1.pdf
Regulatory Filings
2017-11-15 Chinese

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