HiDeep Inc. Logo

HiDeep Inc.

Develops pressure-sensitive 3D touch HMI solutions for the global mobile device market.

365590 | KO

Overview

Corporate Details

ISIN(s):
KR7365590009
LEI:
Country:
South Korea
Address:
경기도 성남시 분당구 대왕판교로644번길 49 DTC타워 10층(삼평동), 성남시
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

HiDeep Inc. is a technology company specializing in advanced Human-Machine Interface (HMI) solutions that enhance user interaction with digital devices. Founded in 2010, the company develops and provides a comprehensive suite of touch technologies, including sensor hardware, proprietary integrated circuits, and software. HiDeep's flagship offering is its 3D Touch technology, which introduces a pressure-sensitive dimension (Z-axis) to enable advanced single-finger gestures and a more intuitive user experience. The company's solutions are primarily targeted at the global mobile device market, with a focus on applications for various displays, including flexible OLEDs.

Unlock This Filing & Millions More

You're one step away from the data you need. Create a free account to instantly view this filing and get access to powerful research tools.

Filings

You have of free filing views remaining. Upgrade for unlimited access.
Quick Filters:

Filters

Clear
Bulk Actions:
Date Filing Language Size Actions
2025-09-08 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-09-08 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 110.3 KB
2025-08-14 00:00
Interim Report
반기보고서 (2025.06)
Korean 902.0 KB
2025-06-26 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-30 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-30 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 113.0 KB
2025-05-15 00:00
Quarterly Report
분기보고서 (2025.03)
Korean 622.8 KB
2025-05-08 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-08 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-08 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-08 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 112.0 KB
2025-05-08 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-07 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-07 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.2 KB
2025-04-15 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(약식)
Korean 64.8 KB

Automate Your Workflow. Get a real-time feed of all HiDeep Inc. filings delivered via API.

Explore Data Feeds →

Market Data

Market Data Not Available

Financials & KPIs

No data available

Unlock Full Financials for HiDeep Inc.

This data is available as part of our premium data solutions. Contact our team for access.

Need More History? Access decades of standardized financials for HiDeep Inc. via our API.

Get Historical Data →

Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

BEL FUSE INC /NJ Logo
Designs and makes components to power, protect, and connect circuits for various industries.
United States of America
BELFA
BHCo.,Ltd. Logo
A specialized manufacturer of Flexible Printed Circuit Boards for mobile and electronic devices.
South Korea
090460
Manufactures smart cards, including metal credit cards, for payment and identification solutions.
South Korea
038460
Blaize Holdings, Inc. Logo
Provides full-stack AI hardware and software for efficient edge and data center computing.
United States of America
BZAI
Manufactures PCBs for network/communication equipment and develops EV power modules.
South Korea
191600
Broadcom Inc. Logo
Designs semiconductor & infrastructure software for cloud, data center, and networking markets.
United States of America
AVGO
CammSys Corp. Logo
Manufactures camera & biometric modules for electronics, expanding into EV and digital health tech.
South Korea
050110
Designs and makes ultra-thin, high-power supercapacitors for IoT, robotics, and electronics.
Australia
CPX
Castrico Co.,Ltd. Logo
Provides custom semiconductor design (LSI, ASIC, FPGA), manufacturing, and assembly services.
Japan
6695
CHEMTRONICSCo.,Ltd. Logo
Develops advanced materials and components for semiconductor, electronics, and automotive industries.
South Korea
089010

Talk to a Data Expert

Have a question? We'll get back to you promptly.