HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2024年限制性股票激励计划首次授予相关事项的法律意见书 | 2024-12-03 | Chinese | |
| 晶华微关于召开2024年第三次临时股东大会的通知 | 2024-12-03 | Chinese | |
| 晶华微内幕信息管理制度 | 2024-12-03 | Chinese | |
| 晶华微防范大股东及关联方资金占用制度 | 2024-12-03 | Chinese | |
| 晶华微第二届董事会第十次会议决议公告 | 2024-12-03 | Chinese | |
| 晶华微对外投资管理制度 | 2024-12-03 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 39468207 | 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2024年限制性股票激励计划首次授予相关事项的法律意见书 | 2024-12-03 | Chinese | ||
| 39468196 | 晶华微关于召开2024年第三次临时股东大会的通知 | 2024-12-03 | Chinese | ||
| 39468179 | 晶华微内幕信息管理制度 | 2024-12-03 | Chinese | ||
| 39468173 | 晶华微防范大股东及关联方资金占用制度 | 2024-12-03 | Chinese | ||
| 39468164 | 晶华微第二届董事会第十次会议决议公告 | 2024-12-03 | Chinese | ||
| 39468156 | 晶华微对外投资管理制度 | 2024-12-03 | Chinese | ||
| 39468151 | 上海信公轶禾企业管理咨询有限公司关于杭州晶华微电子股份有限公司2024年限制性股票激励计划首次授予相关事项之独立财务顾问报告 | 2024-12-03 | Chinese | ||
| 39468132 | 晶华微关联交易管理制度 | 2024-12-03 | Chinese | ||
| 39468122 | 晶华微累积投票制度实施细则 | 2024-12-03 | Chinese | ||
| 39468113 | 晶华微监事会关于公司2024年限制性股票激励计划首次授予激励对象名单的核查意见（截至授予日） | 2024-12-03 | Chinese | ||
| 39468108 | 晶华微关于修订《公司章程》及部分治理制度的公告 | 2024-12-03 | Chinese | ||
| 39468086 | 晶华微第二届监事会第七次会议决议公告 | 2024-12-03 | Chinese | ||
| 39468076 | 晶华微2024年限制性股票激励计划首次授予激励对象名单（截至授予日） | 2024-12-03 | Chinese | ||
| 39468065 | 晶华微公司章程 | 2024-12-03 | Chinese | ||
| 39468054 | 晶华微信息披露事务管理制度 | 2024-12-03 | Chinese | ||
Market data
Market data not available
Price history
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HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
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