HANGZHOU SDIC MICROELECTRONICS INC. — Investor Relations & Filings
About HANGZHOU SDIC MICROELECTRONICS INC.
HANGZHOU SDIC MICROELECTRONICS INC. is a high-tech enterprise specializing in the research, development, and design of integrated circuits (ICs). The company focuses on high-performance analog and mixed-signal chips, with a product portfolio that includes power management ICs, battery management systems (BMS), and motor control solutions. Its technical expertise extends to precision measurement and signal chain products designed for industrial control, automotive electronics, and consumer electronics markets. By leveraging advanced semiconductor technologies, the company provides comprehensive chip-level solutions aimed at improving energy efficiency and system reliability. HANGZHOU SDIC MICROELECTRONICS INC. maintains a strong emphasis on independent innovation and R&D to meet the evolving demands of the global semiconductor landscape.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2023年限制性股票激励计划调整首次授予限制性股票授予价格和授予数量、作废部分限制性股票暨首次授予第一个归属期归属条件成就事项之法律意见书 | 2025-02-20 | Chinese | |
| 晶华微第二届董事会第十二次会议决议公告 | 2025-02-20 | Chinese | |
| 晶华微第二届监事会第八次会议决议公告 | 2025-02-20 | Chinese | |
| 晶华微关于核心技术人员变动的公告 | 2025-01-24 | Chinese | |
| 海通证券股份有限公司关于杭州晶华微电子股份有限公司核心技术人员变动的核查意见 | 2025-01-24 | Chinese | |
| 晶华微2024年年度业绩预告 | 2025-01-17 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
7 filings
| |||||
| 39468380 | 北京天驰君泰（杭州）律师事务所关于杭州晶华微电子股份有限公司2023年限制性股票激励计划调整首次授予限制性股票授予价格和授予数量、作废部分限制性股票暨首次授予第一个归属期归属条件成就事项之法律意见书 | 2025-02-20 | Chinese | ||
| 39468369 | 晶华微第二届董事会第十二次会议决议公告 | 2025-02-20 | Chinese | ||
| 39468361 | 晶华微第二届监事会第八次会议决议公告 | 2025-02-20 | Chinese | ||
| 39468351 | 晶华微关于核心技术人员变动的公告 | 2025-01-24 | Chinese | ||
| 39468341 | 海通证券股份有限公司关于杭州晶华微电子股份有限公司核心技术人员变动的核查意见 | 2025-01-24 | Chinese | ||
| 39468334 | 晶华微2024年年度业绩预告 | 2025-01-17 | Chinese | ||
| 39468325 | 晶华微关于控股股东、实际控制人、董事长增持公司股份进展的公告 | 2025-01-07 | Chinese | ||
|
2024
8 filings
| |||||
| 39468318 | 晶华微关于完成工商变更登记并换发营业执照的公告 | 2024-12-30 | Chinese | ||
| 39468311 | 晶华微关于收购深圳芯邦智芯微电子有限公司100%股权进展暨完成工商变更登记的公告 | 2024-12-27 | Chinese | ||
| 39468309 | 晶华微关于收购深圳芯邦智芯微电子有限公司100%股权的公告 | 2024-12-20 | Chinese | ||
| 39468303 | 晶华微2024年第三次临时股东大会决议公告 | 2024-12-20 | Chinese | ||
| 39468289 | 北京高朋（杭州）律师事务所关于杭州晶华微电子股份有限公司2024年第三次临时股东大会法律意见书 | 2024-12-20 | Chinese | ||
| 39468276 | 晶华微2024年第三次临时股东大会会议资料 | 2024-12-12 | Chinese | ||
| 39468263 | 晶华微关于向激励对象首次授予限制性股票的公告 | 2024-12-03 | Chinese | ||
| 39468217 | 晶华微董事会秘书工作细则 | 2024-12-03 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
Abonmax Co., Ltd.
Develops AI-driven systems, UAVs, electronic components, an…
|
2429 | TW | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
ACBEL POLYTECH INC.
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES ELECTRONICS CO., LTD.
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
HANGZHOU SDIC MICROELECTRONICS INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58173/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58173 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58173 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58173 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58173}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANGZHOU SDIC MICROELECTRONICS INC. (id: 58173)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.