
盛合晶微 — Investor Relations & Filings
SJ Semiconductor Co., Ltd. (SJ Semi) specializes in middle-end-of-line (MEOL) manufacturing and advanced packaging services. The company provides comprehensive solutions including 12-inch wafer bumping, Wafer Level Chip Scale Packaging (WLCSP), and Fan-out Wafer Level Packaging (FOWLP). It focuses on high-density interconnect technologies and 2.5D/3D integration to support high-performance computing, mobile communications, and automotive electronics. SJ Semi operates as an independent foundry, offering advanced node processing for 28nm and below. Its services encompass wafer testing and final assembly, ensuring high reliability and performance for complex integrated circuits. By bridging the gap between front-end wafer fabrication and back-end assembly, the company enables miniaturization and enhanced power efficiency for global chip designers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的公告 | 2026-05-29 | Chinese | |
| 关于召开2025年年度股东会的通知 | 2026-05-29 | Chinese | |
| 董事会关于独立董事独立性自查情况的专项报告 | 2026-05-29 | Chinese | |
| 中国国际金融股份有限公司关于盛合晶微半导体有限公司使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的核查意见 | 2026-05-29 | Chinese | |
| 2025年度独立董事述职报告(严勇) | 2026-05-29 | Chinese | |
| 董事会审计委员会对会计师事务所2025年度履行监督职责情况报告 | 2026-05-29 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 47897891 | 关于使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的公告 | 2026-05-29 | Chinese | ||
| 47897890 | 关于召开2025年年度股东会的通知 | 2026-05-29 | Chinese | ||
| 47897889 | 董事会关于独立董事独立性自查情况的专项报告 | 2026-05-29 | Chinese | ||
| 47897662 | 中国国际金融股份有限公司关于盛合晶微半导体有限公司使用募集资金置换预先投入募投项目及已支付发行费用的自筹资金的核查意见 | 2026-05-29 | Chinese | ||
| 47897661 | 2025年度独立董事述职报告(严勇) | 2026-05-29 | Chinese | ||
| 47897659 | 董事会审计委员会对会计师事务所2025年度履行监督职责情况报告 | 2026-05-29 | Chinese | ||
| 47897640 | 董事、高级管理人员持股及变动管理制度 | 2026-05-29 | Chinese | ||
| 47897090 | 2025年度独立董事述职报告(王国建) | 2026-05-29 | Chinese | ||
| 47897087 | 2025年度会计师事务所的履职情况评估报告 | 2026-05-29 | Chinese | ||
| 47897086 | 关于修订《公司章程》及修订、制定部分治理制度的公告 | 2026-05-29 | Chinese | ||
| 47897085 | 董事、高级管理人员薪酬管理制度 | 2026-05-29 | Chinese | ||
| 47897084 | 中国国际金融股份有限公司关于盛合晶微半导体有限公司调整募集资金投资项目拟投入募集资金金额的核查意见 | 2026-05-29 | Chinese | ||
| 46365795 | 股票交易异常波动公告 | 2026-05-15 | Chinese | ||
| 45016230 | 股票交易异常波动公告 | 2026-05-11 | Chinese | ||
| 39602560 | 关于修订《公司章程》的公告 | 2026-04-29 | Chinese | ||
Market data
Market data not available
Price history
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盛合晶微 via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58660/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58660 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58660 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
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Python
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