盛合晶微 — Investor Relations & Filings
SJ Semiconductor Co., Ltd. (SJ Semi) specializes in middle-end-of-line (MEOL) manufacturing and advanced packaging services. The company provides comprehensive solutions including 12-inch wafer bumping, Wafer Level Chip Scale Packaging (WLCSP), and Fan-out Wafer Level Packaging (FOWLP). It focuses on high-density interconnect technologies and 2.5D/3D integration to support high-performance computing, mobile communications, and automotive electronics. SJ Semi operates as an independent foundry, offering advanced node processing for 28nm and below. Its services encompass wafer testing and final assembly, ensuring high reliability and performance for complex integrated circuits. By bridging the gap between front-end wafer fabrication and back-end assembly, the company enables miniaturization and enhanced power efficiency for global chip designers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 股票交易异常波动公告 | 2026-05-15 | Chinese | |
| 股票交易异常波动公告 | 2026-05-11 | Chinese | |
| 关于修订《公司章程》的公告 | 2026-04-29 | Chinese | |
| 2026年第一季度报告 | 2026-04-29 | Chinese | |
| 盛合晶微公司章程 | 2026-04-29 | English | |
| 盛合晶微首次公开发行股票科创板上市公告书 | 2026-04-19 | Chinese |
Browse filings by year
1 year| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46365795 | 股票交易异常波动公告 | 2026-05-15 | Chinese | ||
| 45016230 | 股票交易异常波动公告 | 2026-05-11 | Chinese | ||
| 39602560 | 关于修订《公司章程》的公告 | 2026-04-29 | Chinese | ||
| 39602552 | 2026年第一季度报告 | 2026-04-29 | Chinese | ||
| 39602545 | 盛合晶微公司章程 | 2026-04-29 | English | ||
| 39602529 | 盛合晶微首次公开发行股票科创板上市公告书 | 2026-04-19 | Chinese | ||
| 39602428 | 盛合晶微公司章程 | 2026-04-19 | English | ||
| 39602115 | 盛合晶微首次公开发行股票科创板上市公告书提示性公告 | 2026-04-19 | Chinese | ||
| 34890123 | 盛合晶微首次公开发行股票并在科创板上市招股说明书 | 2026-04-14 | Chinese | ||
| 34890111 | 盛合晶微首次公开发行股票并在科创板上市招股说明书提示性公告 | 2026-04-14 | Chinese | ||
| 34855045 | 盛合晶微首次公开发行股票并在科创板上市发行结果公告 | 2026-04-14 | Chinese | ||
| 39602104 | 盛合晶微首次公开发行股票并在科创板上市网下初步配售结果及网上中签结果公告 | 2026-04-12 | Chinese | ||
| 39602101 | 盛合晶微首次公开发行股票并在科创板上市网上发行申购情况及中签率公告 | 2026-04-09 | Chinese | ||
| 39602092 | 盛合晶微首次公开发行股票并在科创板上市发行公告 | 2026-04-07 | Chinese | ||
| 39602089 | 中国国际金融股份有限公司、中信证券股份有限公司关于盛合晶微半导体有限公司首次公开发行股票并在科创板上市参与战略配售的投资者核查的专项核查报告 | 2026-04-07 | Chinese | ||
Market data
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Price history
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盛合晶微 via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58660/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58660 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58660 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
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Python
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