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盛合晶微 — Investor Relations & Filings

Ticker · 688820 Shanghai Stock Exchange Manufacturing
Open in API
Filings indexed 34 across all filing types
Latest filing 2026-03-30 Capital/Financing Update
Country CN China
Listing Shanghai Stock Exchange 688820

About 盛合晶微

https://www.sjsemi.com/

SJ Semiconductor Co., Ltd. (SJ Semi) specializes in middle-end-of-line (MEOL) manufacturing and advanced packaging services. The company provides comprehensive solutions including 12-inch wafer bumping, Wafer Level Chip Scale Packaging (WLCSP), and Fan-out Wafer Level Packaging (FOWLP). It focuses on high-density interconnect technologies and 2.5D/3D integration to support high-performance computing, mobile communications, and automotive electronics. SJ Semi operates as an independent foundry, offering advanced node processing for 28nm and below. Its services encompass wafer testing and final assembly, ensuring high reliability and performance for complex integrated circuits. By bridging the gap between front-end wafer fabrication and back-end assembly, the company enables miniaturization and enhanced power efficiency for global chip designers.

Recent filings

Filing Released Lang Actions
盛合晶微首次公开发行股票并在科创板上市招股意向书附录
Capital/Financing Update Classification · 95% confidence The document is titled as an "发行保荐书" (Issuance Sponsorship Letter) related to the initial public offering (IPO) and listing of SJ Semiconductor Corporation on the STAR Market (科创板). It includes detailed sections on the securities issuance, the sponsor institution's responsibilities, legal and audit reports, internal control audit reports, and profit distribution policies. The document is comprehensive and lengthy (15,000 characters), containing detailed financial and legal information related to the IPO process. It is not a simple announcement or a brief summary but a formal sponsorship report required for the IPO process in China. This type of document is best classified under Capital/Financing Update (CAP) because it relates to the company's capital raising activities and the IPO process, including the sponsor's due diligence and recommendations. It is not an Annual Report, Audit Report, or Earnings Release, nor is it a regulatory filing or announcement. Therefore, the most appropriate classification is CAP with high confidence.
2026-03-30 Chinese
盛合晶微首次公开发行股票并在科创板上市发行安排及初步询价公告
Capital/Financing Update Classification · 100% confidence The document is a detailed announcement regarding the initial public offering (IPO) of SJ Semiconductor Corporation on the Shanghai Stock Exchange's STAR Market (科创板). It includes extensive information about the issuance arrangement, preliminary pricing, strategic placement, underwriting, investor qualifications, timetable, and risk disclosures. The document references regulatory approvals from the China Securities Regulatory Commission and Shanghai Stock Exchange rules, and it outlines the offering size, pricing mechanism, and investor participation details. This type of document is characteristic of a Capital/Financing Update, as it provides comprehensive information about the company's fundraising activity and stock issuance process. It is not a financial report, earnings release, or management report, but rather a formal announcement of the IPO issuance and related arrangements.
2026-03-30 Chinese
盛合晶微首次公开发行股票并在科创板上市招股意向书提示性公告
Capital/Financing Update Classification · 95% confidence The document is titled as a "首次公开发行股票并在科创板上市招股意向书提示性公告" which translates to "Initial Public Offering and Listing on the STAR Market Prospectus Indicative Announcement." It discusses the approval of the IPO registration by the China Securities Regulatory Commission and the Shanghai Stock Exchange, details about the issuance, pricing, subscription codes, and dates related to the IPO process. The document is relatively short (3010 characters) and serves as an announcement regarding the IPO prospectus and issuance arrangements rather than the full prospectus or detailed financial report itself. It does not contain financial statements or detailed financial analysis but rather informs investors about the IPO process and where to find the full prospectus. Therefore, it fits best into the category of Capital/Financing Update (CAP), which covers updates on company fundraising and capital structure changes such as IPO announcements.
2026-03-30 Chinese
盛合晶微首次公开发行股票并在科创板上市招股意向书
Capital/Financing Update Classification · 95% confidence The document is titled as a "招股意向书" which translates to "Prospectus" or "Offering Intention Document" related to an initial public offering (IPO) and listing on the STAR Market (科创板). It contains detailed information about the company's business, financial data, governance, risk factors, financing plans, and future development. It is a comprehensive document prepared for investors prior to the company's public offering and listing. This type of document is not an annual report, earnings release, or any other report type listed but is a prospectus or offering document. Among the given categories, none explicitly mention IPO prospectuses, but the closest and most appropriate category for such a document is "Capital/Financing Update (CAP)" since it relates to company fundraising and capital structure changes through an IPO. The document is lengthy (15,000 characters) and contains substantive financial and business information, not just an announcement or summary, so it is not a report publication announcement or regulatory filing. Therefore, the best classification is CAP with high confidence.
2026-03-30 Chinese

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