
CHINA WAFER LEVEL CSP CO.,LTD. — Investor Relations & Filings
China Wafer Level CSP Co., Ltd. specializes in advanced semiconductor packaging and testing services, focusing on Wafer Level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), and System-in-Package (SiP) solutions. The company provides a comprehensive suite of services including bumping, redistribution layer (RDL) fabrication, and integrated circuit testing. These technologies facilitate the miniaturization and performance enhancement of semiconductor devices across diverse sectors such as mobile communications, consumer electronics, automotive electronics, and the Internet of Things (IoT). By utilizing high-density integration and advanced thermal management, the company delivers high-reliability solutions for image sensors, biometric sensors, and power management ICs. Its technical capabilities support the production of compact, high-speed, and energy-efficient electronic components for a global client base.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 晶方科技关联交易管理制度(2025年12月修订) | 2025-12-26 | Chinese | |
| 晶方科技第六届董事会第一次会议决议公告 | 2025-12-26 | Chinese | |
| 晶方科技董事会秘书工作制度(2025年12月修订) | 2025-12-26 | Chinese | |
| 晶方科技关于公司2026年日常关联交易预计情况的公告 | 2025-12-26 | Chinese | |
| 晶方科技关于2025年第三季度业绩说明会召开情况的公告 | 2025-11-04 | Chinese | |
| 晶方科技2025年第三季度报告 | 2025-10-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 36909165 | 晶方科技关联交易管理制度(2025年12月修订) | 2025-12-26 | Chinese | ||
| 36909164 | 晶方科技第六届董事会第一次会议决议公告 | 2025-12-26 | Chinese | ||
| 36909162 | 晶方科技董事会秘书工作制度(2025年12月修订) | 2025-12-26 | Chinese | ||
| 36909158 | 晶方科技关于公司2026年日常关联交易预计情况的公告 | 2025-12-26 | Chinese | ||
| 36909157 | 晶方科技关于2025年第三季度业绩说明会召开情况的公告 | 2025-11-04 | Chinese | ||
| 36909144 | 晶方科技2025年第三季度报告 | 2025-10-27 | Chinese | ||
| 36909142 | 晶方科技关于召开2025年第三季度业绩说明会的公告 | 2025-10-27 | Chinese | ||
| 36909130 | 晶方科技股东未减持公司股份并提前终止大宗交易减持计划的公告 | 2025-09-10 | Chinese | ||
| 36909112 | 晶方科技2025年第一次临时股东大会法律意见书 | 2025-09-08 | Chinese | ||
| 36909100 | 晶方科技2025年第一次临时股东大会决议公告 | 2025-09-08 | Chinese | ||
| 36909092 | 晶方科技第六届董事会第一次临时会议决议公告 | 2025-09-08 | Chinese | ||
| 36909085 | 晶方科技关于2025年半年度业绩说明会召开情况的公告 | 2025-09-05 | Chinese | ||
| 36909081 | 晶方科技关于召开2025年半年度业绩说明会的公告 | 2025-08-28 | Chinese | ||
| 36909072 | 晶方科技:独立董事候选人声明与承诺(刘海燕) | 2025-08-22 | Chinese | ||
| 36909068 | 晶方科技:独立董事提名人声明与承诺(王正根) | 2025-08-22 | Chinese | ||
Market data
Market data not available
Price history
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CHINA WAFER LEVEL CSP CO.,LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57340/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57340 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57340 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57340 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57340}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for CHINA WAFER LEVEL CSP CO.,LTD. (id: 57340)"
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