Bomin Electronics Co.,Ltd. — Investor Relations & Filings
About Bomin Electronics Co.,Ltd.
Bomin Electronics Co., Ltd. focuses on the design, manufacture, and distribution of high-precision printed circuit boards (PCBs). Its core product range encompasses high-density interconnect (HDI) boards, multilayer PCBs, flexible circuits, rigid-flex boards, and specialized substrates including high-frequency, high-speed, and metal-core designs. The company provides interconnect solutions for various applications such as automotive systems, communication infrastructure, industrial control, medical devices, and consumer electronics. By leveraging advanced manufacturing technologies and research capabilities, the company delivers high-reliability components tailored for complex electronic architectures and high-performance hardware requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 博敏电子关于以集中竞价交易方式首次回购公司股份的公告 | 2023-10-30 | Chinese | |
| 博敏电子独立董事关于第五届董事会第三次会议相关事项的独立意见 | 2023-10-27 | Chinese | |
| 博敏电子关于2023年前三季度计提资产减值准备的公告 | 2023-10-27 | Chinese | |
| 博敏电子关于通过开立募集资金保证金账户方式开具银行承兑汇票、信用证支付募集资金投资项目款项的公告 | 2023-10-27 | Chinese | |
| 博敏电子第五届董事会第三次会议决议 | 2023-10-27 | Chinese | |
| 博敏电子为子公司申请银行授信提供担保的公告 | 2023-10-27 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37526945 | 博敏电子关于以集中竞价交易方式首次回购公司股份的公告 | 2023-10-30 | Chinese | ||
| 37526937 | 博敏电子独立董事关于第五届董事会第三次会议相关事项的独立意见 | 2023-10-27 | Chinese | ||
| 37526923 | 博敏电子关于2023年前三季度计提资产减值准备的公告 | 2023-10-27 | Chinese | ||
| 37526915 | 博敏电子关于通过开立募集资金保证金账户方式开具银行承兑汇票、信用证支付募集资金投资项目款项的公告 | 2023-10-27 | Chinese | ||
| 37526903 | 博敏电子第五届董事会第三次会议决议 | 2023-10-27 | Chinese | ||
| 37526896 | 博敏电子为子公司申请银行授信提供担保的公告 | 2023-10-27 | Chinese | ||
| 37526881 | 博敏电子2023年第三季度报告 | 2023-10-27 | Chinese | ||
| 37526873 | 博敏电子第五届董事会第三次会议决议公告 | 2023-10-27 | Chinese | ||
| 37526859 | 博敏电子第五届监事会第二次会议决议公告 | 2023-10-27 | Chinese | ||
| 37526851 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2023-10-17 | Chinese | ||
| 37526842 | 博敏电子为子公司申请银行授信提供担保的公告 | 2023-10-11 | Chinese | ||
| 37526830 | 博敏电子关于以集中竞价交易方式回购公司股份的进展公告 | 2023-10-09 | Chinese | ||
| 37526810 | 博敏电子关于回购股份事项前十名股东及前十名无限售条件股东持股情况的公告 | 2023-10-09 | Chinese | ||
| 37526805 | 博敏电子关于以集中竞价交易方式回购公司股份的回购报告书 | 2023-09-28 | Chinese | ||
| 37526789 | 博敏电子独立董事关于以集中竞价交易方式回购公司股份方案的独立意见 | 2023-09-28 | Chinese | ||
Market data
Market data not available
Price history
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Bomin Electronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Bomin Electronics Co.,Ltd. (id: 57911)"
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