Bomin Electronics Co.,Ltd. — Investor Relations & Filings
About Bomin Electronics Co.,Ltd.
Bomin Electronics Co., Ltd. focuses on the design, manufacture, and distribution of high-precision printed circuit boards (PCBs). Its core product range encompasses high-density interconnect (HDI) boards, multilayer PCBs, flexible circuits, rigid-flex boards, and specialized substrates including high-frequency, high-speed, and metal-core designs. The company provides interconnect solutions for various applications such as automotive systems, communication infrastructure, industrial control, medical devices, and consumer electronics. By leveraging advanced manufacturing technologies and research capabilities, the company delivers high-reliability components tailored for complex electronic architectures and high-performance hardware requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 博敏电子2023年第二次临时股东大会会议资料 | 2023-09-01 | Chinese | |
| 博敏电子为子公司申请银行授信提供担保的公告 | 2023-08-29 | Chinese | |
| 博敏电子独立董事候选人声明与承诺（苏武俊） | 2023-08-18 | Chinese | |
| 博敏电子独立董事关于第四届董事会第三十一次会议相关事项的独立意见 | 2023-08-18 | Chinese | |
| 博敏电子2023年半年度报告 | 2023-08-18 | Chinese | |
| 博敏电子第四届董事会第三十一次会议决议公告 | 2023-08-18 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2023
15 filings
| |||||
| 37526565 | 博敏电子2023年第二次临时股东大会会议资料 | 2023-09-01 | Chinese | ||
| 37526558 | 博敏电子为子公司申请银行授信提供担保的公告 | 2023-08-29 | Chinese | ||
| 37526552 | 博敏电子独立董事候选人声明与承诺（苏武俊） | 2023-08-18 | Chinese | ||
| 37526540 | 博敏电子独立董事关于第四届董事会第三十一次会议相关事项的独立意见 | 2023-08-18 | Chinese | ||
| 37526536 | 博敏电子2023年半年度报告 | 2023-08-18 | Chinese | ||
| 37526448 | 博敏电子第四届董事会第三十一次会议决议公告 | 2023-08-18 | Chinese | ||
| 37526437 | 博敏电子关于修订《公司章程》及附件部分条款的公告 | 2023-08-18 | Chinese | ||
| 37526419 | 博敏电子2023年半年度报告摘要 | 2023-08-18 | Chinese | ||
| 37526408 | 博敏电子关于会计政策变更的公告 | 2023-08-18 | Chinese | ||
| 37526388 | 博敏电子第四届监事会第二十七次会议决议公告 | 2023-08-18 | Chinese | ||
| 37526377 | 博敏电子关于2023年半年度募集资金存放与实际使用情况的专项报告 | 2023-08-18 | Chinese | ||
| 37526366 | 博敏电子独立董事提名人声明与承诺（苏武俊） | 2023-08-18 | Chinese | ||
| 37526351 | 博敏电子独立董事候选人声明与承诺（洪芳） | 2023-08-18 | Chinese | ||
| 37526345 | 博敏电子关于召开2023年第二次临时股东大会的通知 | 2023-08-18 | Chinese | ||
| 37526329 | 博敏电子关于召开2023年半年度度业绩说明会的公告 | 2023-08-18 | Chinese | ||
Market data
Market data not available
Price history
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Bomin Electronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Bomin Electronics Co.,Ltd. (id: 57911)"
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