Bomin Electronics Co.,Ltd. — Investor Relations & Filings
About Bomin Electronics Co.,Ltd.
Bomin Electronics Co., Ltd. focuses on the design, manufacture, and distribution of high-precision printed circuit boards (PCBs). Its core product range encompasses high-density interconnect (HDI) boards, multilayer PCBs, flexible circuits, rigid-flex boards, and specialized substrates including high-frequency, high-speed, and metal-core designs. The company provides interconnect solutions for various applications such as automotive systems, communication infrastructure, industrial control, medical devices, and consumer electronics. By leveraging advanced manufacturing technologies and research capabilities, the company delivers high-reliability components tailored for complex electronic architectures and high-performance hardware requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 博敏电子关于实际控制人、高级管理人员增持公司股份计划的公告 | 2024-01-31 | Chinese | |
| 博敏电子关于2023年第四季度计提资产减值准备的公告 | 2024-01-30 | Chinese | |
| 博敏电子2023年度业绩预告公告 | 2024-01-30 | Chinese | |
| 博敏电子为子公司申请银行授信提供担保的公告 | 2024-01-30 | Chinese | |
| 博敏电子关于子公司为公司申请银行授信提供担保的公告 | 2024-01-30 | Chinese | |
| 博敏电子关于控股股东补充质押的公告 | 2024-01-23 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
11 filings
| |||||
| 37527254 | 博敏电子关于实际控制人、高级管理人员增持公司股份计划的公告 | 2024-01-31 | Chinese | ||
| 37527242 | 博敏电子关于2023年第四季度计提资产减值准备的公告 | 2024-01-30 | Chinese | ||
| 37527230 | 博敏电子2023年度业绩预告公告 | 2024-01-30 | Chinese | ||
| 37527223 | 博敏电子为子公司申请银行授信提供担保的公告 | 2024-01-30 | Chinese | ||
| 37527219 | 博敏电子关于子公司为公司申请银行授信提供担保的公告 | 2024-01-30 | Chinese | ||
| 37527204 | 博敏电子关于控股股东补充质押的公告 | 2024-01-23 | Chinese | ||
| 37527196 | 博敏电子为子公司申请银行授信提供担保的公告 | 2024-01-23 | Chinese | ||
| 37527189 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-01-18 | Chinese | ||
| 37527176 | 博敏电子关于使用部分闲置募集资金进行现金管理的进展公告 | 2024-01-16 | Chinese | ||
| 37527165 | 博敏电子关于年度审计机构变更质量控制复核人的公告 | 2024-01-05 | Chinese | ||
| 37527152 | 博敏电子关于以集中竞价交易方式回购公司股份的进展公告 | 2024-01-03 | Chinese | ||
|
2023
4 filings
| |||||
| 37527146 | 博敏电子为子公司申请银行授信提供担保的公告 | 2023-12-22 | Chinese | ||
| 37527136 | 博敏电子关于控股股东质押延期购回及补充质押的公告 | 2023-12-13 | Chinese | ||
| 37527130 | 博敏电子募集资金管理制度（2023年12月修订） | 2023-12-04 | Chinese | ||
| 37527118 | 博敏电子2023年第三次临时股东大会决议公告 | 2023-12-04 | Chinese | ||
Market data
Market data not available
Price history
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Bomin Electronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/57911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=57911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=57911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=57911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 57911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Bomin Electronics Co.,Ltd. (id: 57911)"
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