
Xiamen Hongxin Electronics Technology Group Inc. — Investor Relations & Filings
Xiamen Hongxin Electronics Technology Group Inc. specializes in the research, development, design, and manufacturing of Flexible Printed Circuits (FPC). The company provides a comprehensive range of products, including single-sided, double-sided, multi-layer, and rigid-flex boards, alongside Surface Mount Technology (SMT) assembly services. Its solutions are primarily utilized in consumer electronics such as smartphones, tablets, and wearable devices, as well as in automotive electronics, industrial control systems, and medical equipment. Hongxin Electronics focuses on high-precision and high-density interconnect technologies, offering customized FPC solutions to global technology brands. The group has expanded its strategic focus to include high-speed interconnect components and AI computing infrastructure, leveraging its expertise in electronic circuitry to support advanced data processing and telecommunications requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 北京国枫律师事务所关于厦门弘信电子科技集团股份有限公司2025年年度股东会的法律意见书 | 2026-05-20 | Chinese | |
| 2025年年度股东会决议公告 | 2026-05-20 | Chinese | |
| 关于控股股东进行股票质押式回购交易的公告 | 2026-05-20 | Chinese | |
| 关于股票交易异常波动的公告 | 2026-05-19 | Chinese | |
| 2026年员工持股计划第一次持有人会议决议公告 | 2026-05-14 | Chinese | |
| 北京国枫律师事务所关于厦门弘信电子科技集团股份有限公司2024年度向特定对象发行股票的补充法律意见书之二 | 2026-05-14 | Chinese |
Browse filings by year
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Price history
Peer group · Manufacture of other electronic components and boards
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|---|---|---|---|
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3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
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177900 | KR | Manufacturing |
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3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
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688536 | CN | Manufacturing |
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4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
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4DS | AU | Manufacturing |
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AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
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036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
Xiamen Hongxin Electronics Technology Group Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55636/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55636 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55636 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55636 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55636}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Xiamen Hongxin Electronics Technology Group Inc. (id: 55636)"
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