UNION SEMICONDUCTOR (HEFEI) CO., LTD. — Investor Relations & Filings
Union Semiconductor (Hefei) Co., Ltd. is an integrated circuit design enterprise specializing in high-performance analog and mixed-signal solutions. The company focuses on the research, development, and distribution of power management integrated circuits (PMICs), including DC-DC converters, linear regulators (LDOs), and battery management systems. Its product portfolio also encompasses signal chain components, interface ICs, and specialized drivers. These products are engineered for applications across consumer electronics, industrial automation, telecommunications, and automotive electronics. By prioritizing technical innovation and high-efficiency design, the company provides reliable semiconductor components characterized by low power consumption and compact form factors, supporting the requirements of advanced electronic systems and power-sensitive applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于合肥新汇成微电子股份有限公司2025年度募集资金存放与实际使用情况鉴证报告 | 2026-03-19 | Chinese | |
| 关于变更注册资本、调整董事会人数、修订《公司章程》并办理工商变更登记暨制定、修订部分公司治理制度的公告 | 2026-03-19 | Chinese | |
| 关于2025年度计提减值准备的公告 | 2026-03-19 | Chinese | |
| 关于使用部分暂时闲置自有资金进行现金管理的公告 | 2026-03-19 | Chinese | |
| 关于开展外汇套期保值交易的公告 | 2026-03-19 | Chinese | |
| 独立董事工作制度(2026年3月修订) | 2026-03-19 | Chinese |
Browse filings by year
5 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 39545957 | 关于合肥新汇成微电子股份有限公司2025年度募集资金存放与实际使用情况鉴证报告 | 2026-03-19 | Chinese | ||
| 39545894 | 关于变更注册资本、调整董事会人数、修订《公司章程》并办理工商变更登记暨制定、修订部分公司治理制度的公告 | 2026-03-19 | Chinese | ||
| 39545893 | 关于2025年度计提减值准备的公告 | 2026-03-19 | Chinese | ||
| 39545887 | 关于使用部分暂时闲置自有资金进行现金管理的公告 | 2026-03-19 | Chinese | ||
| 39545882 | 关于开展外汇套期保值交易的公告 | 2026-03-19 | Chinese | ||
| 39545871 | 独立董事工作制度(2026年3月修订) | 2026-03-19 | Chinese | ||
| 39545863 | 关于召开2025年年度股东会的通知 | 2026-03-19 | Chinese | ||
| 39545840 | 关于授信及担保额度预计的公告 | 2026-03-19 | Chinese | ||
| 39545828 | 董事和高级管理人员薪酬与考核管理制度(2026年3月制定) | 2026-03-19 | Chinese | ||
| 39545821 | 2025年度独立董事述职报告(蔺智挺) | 2026-03-19 | Chinese | ||
| 39545814 | 2025年度审计报告 | 2026-03-19 | Chinese | ||
| 39545812 | 2025年度独立董事述职报告(杨辉) | 2026-03-19 | Chinese | ||
| 39545802 | 国泰海通证券股份有限公司关于合肥新汇成微电子股份有限公司提前赎回汇成转债的专项核查意见 | 2026-03-16 | Chinese | ||
| 39545800 | 关于提前赎回“汇成转债”的公告 | 2026-03-16 | Chinese | ||
| 39545794 | 关于“汇成转债”可能满足赎回条件的提示性公告 | 2026-03-09 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
3ALogics. Inc.
Designs and develops NFC and RFID System-on-Chips (SoCs) fo…
|
177900 | KR | Manufacturing |
|
3peak Incorporated
Designs analog and mixed-signal ICs for signal chain and po…
|
688536 | CN | Manufacturing |
|
4DS MEMORY LIMITED
Develops Interface Switching ReRAM for high-density Storage…
|
4DS | AU | Manufacturing |
|
AAC Technologies Holdings Inc.
Global provider of sensory solutions and miniaturized compo…
|
2018 | KY | Manufacturing |
|
ABCO ELECTRONICS CO., LTD.
Manufacturer of passive electronic components like inductor…
|
036010 | KR | Manufacturing |
|
ABOV Semiconductor Co.,Ltd.
Designs and manufactures MCUs, touch sensors, and non-volat…
|
102120 | KR | Manufacturing |
|
Acbel
Designs and manufactures switching power supplies for 5G, m…
|
6282 | TW | Manufacturing |
|
Accelink Technologies Co., Ltd.
Produces optoelectronic components and modules for telecom …
|
002281 | CN | Manufacturing |
|
ACES
Global provider of high-precision electronic components and…
|
3605 | TW | Manufacturing |
|
ACTIONS TECHNOLOGY CO., LTD.
Designs low-power wireless and multimedia SoCs for audio an…
|
688049 | CN | Manufacturing |
UNION SEMICONDUCTOR (HEFEI) CO., LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/58403/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=58403 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=58403 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=58403 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 58403}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for UNION SEMICONDUCTOR (HEFEI) CO., LTD. (id: 58403)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.