
Tripod — Investor Relations & Filings
Tripod Technology Corporation is a global leader in the design and manufacturing of printed circuit boards (PCBs). Established in 1991, the company provides a comprehensive range of products, including multi-layer boards, High-Density Interconnect (HDI) PCBs, and rigid-flex solutions. Its technical capabilities support a wide array of applications across sectors such as automotive electronics, telecommunications, consumer products, servers, and memory modules. Operating multiple research and production facilities, the company delivers world-class manufacturing services to a diverse international customer base. Tripod Technology is distinguished by its advanced R&D capabilities and its ability to provide integrated, high-precision electronic component solutions that meet evolving global technological requirements.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年第1季大陸投資 | 2026-05-13 | Chinese | |
| 115年第1季海外子公司投資 | 2026-05-13 | Chinese | |
| 115年05月僑外投資持股 | 2026-05-13 | Chinese | |
| 公告本公司115年第一季財務報告董事會召開日期為115年 05月08日 | 2026-04-29 | Chinese | |
| 115年年報及股東會資料 — 2026_3044_20260529F01.pdf | 2026-04-28 | Chinese | |
| 115年年報及股東會資料 — 2026_3044_20260529F02.pdf | 2026-04-28 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46362044 | 115年第1季大陸投資 | 2026-05-13 | Chinese | ||
| 46363108 | 115年第1季海外子公司投資 | 2026-05-13 | Chinese | ||
| 46361933 | 115年05月僑外投資持股 | 2026-05-13 | Chinese | ||
| 38496423 | 公告本公司115年第一季財務報告董事會召開日期為115年 05月08日 | 2026-04-29 | Chinese | ||
| 37828963 | 115年年報及股東會資料 — 2026_3044_20260529F01.pdf | 2026-04-28 | Chinese | ||
| 37828943 | 115年年報及股東會資料 — 2026_3044_20260529F02.pdf | 2026-04-28 | Chinese | ||
| 37828922 | 115年年報及股東會資料 — 2026_3044_20260529F17.pdf | 2026-04-28 | Chinese | ||
| 37829261 | 115年年報及股東會資料 — 2026_3044_20260529FE1.pdf | 2026-04-28 | English | ||
| 37829232 | 115年年報及股東會資料 — 2026_3044_20260529F13.pdf | 2026-04-28 | Chinese | ||
| 37829204 | 115年年報及股東會資料 — 2026_3044_20260529FE2.pdf | 2026-04-28 | English | ||
| 33992449 | 115年3月背書保證與資金貸與 | 2026-04-10 | Chinese | ||
| 33989739 | 115年3月營業收入 | 2026-04-10 | Chinese | ||
| 33795004 | 115年03月內部人持股異動(事後) | 2026-04-08 | Chinese | ||
| 33795002 | 115年03月董事會成員及持股 | 2026-04-08 | Chinese | ||
| 34319702 | 健鼎受邀參加美銀證券2026 Asia Tech Conference | 2026-03-17 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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BHCo.,Ltd.
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BLUETOP CO.,LTD.
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BLUGLASS LIMITED
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BMC
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BOE HC SemiTek Corporation
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BOE TECHNOLOGY GROUP CO., LTD
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Tripod via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52276/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52276 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52276 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52276 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52276}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Tripod (id: 52276)"
Report missing filing
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