
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 招商证券股份有限公司及国开证券股份有限公司关于公司非公开发行股票之发行过程和认购对象合规性报告 | 2020-11-22 | Chinese | |
| 招商证券股份有限公司关于公司非公开发行股票项目之上市保荐书 | 2020-11-22 | Chinese | |
| 关于披露权益变动报告书的提示性公告 | 2020-11-17 | Chinese | |
| 简式权益变动报告书 | 2020-11-17 | Chinese | |
| 关于增加2020年度日常关联交易计划的补充公告 | 2020-11-02 | Chinese | |
| 2020年第三季度报告正文 | 2020-10-28 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2020
15 filings
| |||||
| 34956482 | 招商证券股份有限公司及国开证券股份有限公司关于公司非公开发行股票之发行过程和认购对象合规性报告 | 2020-11-22 | Chinese | ||
| 34956456 | 招商证券股份有限公司关于公司非公开发行股票项目之上市保荐书 | 2020-11-22 | Chinese | ||
| 34956441 | 关于披露权益变动报告书的提示性公告 | 2020-11-17 | Chinese | ||
| 34956429 | 简式权益变动报告书 | 2020-11-17 | Chinese | ||
| 34956418 | 关于增加2020年度日常关联交易计划的补充公告 | 2020-11-02 | Chinese | ||
| 34956407 | 2020年第三季度报告正文 | 2020-10-28 | Chinese | ||
| 34956395 | 第六届董事会第十九次会议决议公告 | 2020-10-28 | Chinese | ||
| 34956385 | 关于增加2020年度日常关联交易计划的公告 | 2020-10-28 | Chinese | ||
| 34956374 | 2020年第三季度报告全文 | 2020-10-28 | Chinese | ||
| 34956334 | 关于公司第六届董事会第十九次会议相关事项的独立意见 | 2020-10-28 | Chinese | ||
| 34956329 | 第六届监事会第十四次会议决议公告 | 2020-10-28 | Chinese | ||
| 34956316 | 2020年前三季度业绩预告 | 2020-10-12 | Chinese | ||
| 34956307 | 关于股东减持计划实施完毕的公告 | 2020-09-17 | Chinese | ||
| 34956293 | 关于独立董事任期届满的公告 | 2020-09-11 | Chinese | ||
| 34956286 | 关于股东减持计划减持数量过半的进展公告 | 2020-09-08 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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