THine Electronics, Inc.
A fabless semiconductor firm designing high-speed interface LSIs for displays and camera systems.
6769 | T
Overview
Corporate Details
- ISIN(s):
- JP3345600005
- LEI:
- Country:
- Japan
- Address:
- 千代田区神田美土代町９番地１
- Website:
- https://www.thine.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
THine Electronics, Inc. is a fabless semiconductor company that plans, designs, and sells mixed-signal Large-Scale Integration (LSI) circuits and Application Specific Standard Products (ASSPs). The company specializes in high-speed interface technologies, providing solutions that support a wide range of applications, including high-resolution displays and advanced camera systems. Its product portfolio features industry-proven LVDS (Low-Voltage Differential Signaling) SerDes, MIPI interface ICs enabling long-distance data transmission, serial transceivers, and cost-effective LED drivers. As a pioneer that introduced the first LVDS products to the Japanese market, THine leverages its original technologies to create innovative solutions that reduce implementation space and system costs for its customers.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-08-08 08:20 |
Report Publication Announcement
確認書
|
Japanese | 8.2 KB | ||
| 2025-08-08 08:19 |
Interim Report
半期報告書－第34期(2025/01/01－2025/12/31)
|
Japanese | 211.4 KB | ||
| 2025-06-17 04:55 |
Share Issue/Capital Change
訂正臨時報告書
|
Japanese | 33.3 KB | ||
| 2025-06-16 09:45 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 38.7 KB | ||
| 2025-03-31 06:25 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 29.2 KB | ||
| 2025-03-28 06:36 |
Registration Form
確認書
|
Japanese | 8.2 KB | ||
| 2025-03-28 06:35 |
Governance Information
内部統制報告書－第33期(2024/01/01－2024/12/31)
|
Japanese | 23.0 KB | ||
| 2025-03-28 06:34 |
Annual Report
有価証券報告書－第33期(2024/01/01－2024/12/31)
|
Japanese | 838.7 KB | ||
| 2024-11-18 08:11 |
Share Issue/Capital Change
臨時報告書
|
Japanese | 39.8 KB | ||
| 2024-08-09 03:53 |
Report Publication Announcement
確認書
|
Japanese | 8.2 KB | ||
| 2024-08-09 03:52 |
Interim Report
半期報告書－第33期(2024/01/01－2024/12/31)
|
Japanese | 196.5 KB | ||
| 2024-05-14 04:12 |
Quarterly Report
四半期報告書－第33期第1四半期(2024/01/01－2024/03/31)
|
Japanese | 183.0 KB | ||
| 2024-05-14 04:12 |
Report Publication Announcement
確認書
|
Japanese | 8.4 KB | ||
| 2024-03-29 02:15 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 26.2 KB | ||
| 2024-03-27 05:24 |
Registration Form
確認書
|
Japanese | 8.3 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
