THine Electronics, Inc. Logo

THine Electronics, Inc.

A fabless semiconductor firm designing high-speed interface LSIs for displays and camera systems.

6769 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
千代田区神田美土代町9番地1
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

THine Electronics, Inc. is a fabless semiconductor company that plans, designs, and sells mixed-signal Large-Scale Integration (LSI) circuits and Application Specific Standard Products (ASSPs). The company specializes in high-speed interface technologies, providing solutions that support a wide range of applications, including high-resolution displays and advanced camera systems. Its product portfolio features industry-proven LVDS (Low-Voltage Differential Signaling) SerDes, MIPI interface ICs enabling long-distance data transmission, serial transceivers, and cost-effective LED drivers. As a pioneer that introduced the first LVDS products to the Japanese market, THine leverages its original technologies to create innovative solutions that reduce implementation space and system costs for its customers.

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Date Filing Language Size Actions
2025-08-08 08:20
Report Publication Announcement
確認書
Japanese 8.2 KB
2025-08-08 08:19
Interim Report
半期報告書-第34期(2025/01/01-2025/12/31)
Japanese 211.4 KB
2025-06-17 04:55
Share Issue/Capital Change
訂正臨時報告書
Japanese 33.3 KB
2025-06-16 09:45
Share Issue/Capital Change
臨時報告書
Japanese 38.7 KB
2025-03-31 06:25
Regulatory News Service
臨時報告書
Japanese 29.2 KB
2025-03-28 06:36
Registration Form
確認書
Japanese 8.2 KB
2025-03-28 06:35
Governance Information
内部統制報告書-第33期(2024/01/01-2024/12/31)
Japanese 23.0 KB
2025-03-28 06:34
Annual Report
有価証券報告書-第33期(2024/01/01-2024/12/31)
Japanese 838.7 KB
2024-11-18 08:11
Share Issue/Capital Change
臨時報告書
Japanese 39.8 KB
2024-08-09 03:53
Report Publication Announcement
確認書
Japanese 8.2 KB
2024-08-09 03:52
Interim Report
半期報告書-第33期(2024/01/01-2024/12/31)
Japanese 196.5 KB
2024-05-14 04:12
Quarterly Report
四半期報告書-第33期第1四半期(2024/01/01-2024/03/31)
Japanese 183.0 KB
2024-05-14 04:12
Report Publication Announcement
確認書
Japanese 8.4 KB
2024-03-29 02:15
Post-Annual General Meeting Information
臨時報告書
Japanese 26.2 KB
2024-03-27 05:24
Regulatory News Service
確認書
Japanese 8.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
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