TESEC Corporation
Manufactures test systems and handlers for semiconductor and MEMS devices.
6337 | T
Overview
Corporate Details
- ISIN(s):
- JP3545160008
- LEI:
- Country:
- Japan
- Address:
- 東大和市上北台３丁目３９１番地の１
- Website:
- https://www.tesec.co.jp/en/
- Sector:
- Manufacturing
Description
TESEC Corporation is a manufacturer of semiconductor test equipment. The company develops, manufactures, and sells two primary product lines: test systems (testers) and handlers. Its test systems are designed to measure and evaluate the electrical characteristics of semiconductors and MEMS devices, with a particular focus on power device testing. The product range includes dynamic test systems and thermal resistance testers. Complementing these systems, TESEC's automated handlers physically sort and classify devices based on test results, providing comprehensive solutions for both engineering and high-volume production environments.
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Filings
| Date | Filing | Language | Type / Size | Actions | |
|---|---|---|---|---|---|
| 2021-02-05 06:48 |
四半期報告書－第53期第3四半期(令和2年10月1日－令和2年12月31日)
|
Japanese | ZIP • 131.9 KB | ||
| 2020-11-09 08:42 |
四半期報告書－第53期第2四半期(令和2年7月1日－令和2年9月30日)
|
Japanese | ZIP • 157.7 KB | ||
| 2020-08-07 07:57 |
四半期報告書－第53期第1四半期(令和2年4月1日－令和2年6月30日)
|
Japanese | ZIP • 130.0 KB | ||
| 2020-07-31 08:05 |
有価証券報告書－第52期(平成31年4月1日－令和2年3月31日)
|
Japanese | ZIP • 742.5 KB | ||
| 2020-02-07 08:24 |
四半期報告書－第52期第3四半期(令和1年10月1日－令和1年12月31日)
|
Japanese | ZIP • 127.3 KB | ||
| 2019-11-08 07:55 |
四半期報告書－第52期第2四半期(2019/07/01－2019/09/30)
|
Japanese | ZIP • 151.6 KB | ||
| 2019-08-07 08:05 |
四半期報告書－第52期第1四半期(2019/04/01－2019/06/30)
|
Japanese | ZIP • 125.5 KB | ||
| 2019-06-27 07:23 |
有価証券報告書－第51期(平成30年4月1日－平成31年3月31日)
|
Japanese | ZIP • 722.3 KB | ||
| 2019-02-08 08:08 |
四半期報告書－第51期第3四半期(2018/10/01－2018/12/31)
|
Japanese | ZIP • 126.4 KB | ||
| 2018-11-07 05:13 |
四半期報告書－第51期第2四半期(2018/07/01－2018/09/30)
|
Japanese | ZIP • 150.5 KB | ||
| 2018-08-07 07:29 |
四半期報告書－第51期第1四半期(2018/04/01－2018/06/30)
|
Japanese | ZIP • 123.4 KB | ||
| 2018-06-28 07:49 |
有価証券報告書－第50期(平成29年4月1日－平成30年3月31日)
|
Japanese | ZIP • 619.5 KB | ||
| 2018-02-08 06:35 |
四半期報告書－第50期第3四半期(2017/10/01－2017/12/31)
|
Japanese | ZIP • 119.5 KB | ||
| 2017-11-08 08:09 |
四半期報告書－第50期第2四半期(2017/07/01－2017/09/30)
|
Japanese | ZIP • 146.8 KB | ||
| 2017-08-07 08:12 |
四半期報告書－第50期第1四半期(2017/04/01－2017/06/30)
|
Japanese | ZIP • 119.6 KB |
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
