
TECNISCO, LTD. — Investor Relations & Filings
TECNISCO, LTD. is a manufacturer and service provider of precision-processed components, specializing in materials such as glass, metal, and silicon. The company utilizes its proprietary "Cross-edge" technology, which integrates five core processes: cutting, grinding, polishing, metalizing, and bonding. Its primary products include metal heatsinks for optical communication, industrial lasers, and power semiconductors, as well as glass components for display devices, sensors, mobile devices, and biotechnology/medical equipment. TECNISCO also produces drilling tools and processes other materials like ceramics and sapphire to meet diverse customer needs.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 確認書 | 2025-09-26 | Japanese | |
| 有価証券報告書-第57期(2024/07/01-2025/06/30) | 2025-09-26 | Japanese | |
| 臨時報告書 | 2025-06-25 | Japanese | |
| 確認書 | 2025-02-14 | Japanese | |
| 半期報告書-第57期(2024/07/01-2025/06/30) | 2025-02-14 | Japanese | |
| 臨時報告書 | 2024-09-30 | Japanese |
Browse filings by year
3 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
5 filings
| |||||
| 7931864 | 確認書 | 2025-09-26 | Japanese | ||
| 7931863 | 有価証券報告書-第57期(2024/07/01-2025/06/30) | 2025-09-26 | Japanese | ||
| 7250220 | 臨時報告書 | 2025-06-25 | Japanese | ||
| 7277033 | 確認書 | 2025-02-14 | Japanese | ||
| 7277027 | 半期報告書-第57期(2024/07/01-2025/06/30) | 2025-02-14 | Japanese | ||
|
2024
8 filings
| |||||
| 7306814 | 臨時報告書 | 2024-09-30 | Japanese | ||
| 7307310 | 内部統制報告書-第56期(2023/07/01-2024/06/30) | 2024-09-27 | Japanese | ||
| 7307313 | 有価証券報告書-第56期(2023/07/01-2024/06/30) | 2024-09-27 | Japanese | ||
| 7307306 | 確認書 | 2024-09-27 | Japanese | ||
| 7337525 | 確認書 | 2024-05-15 | Japanese | ||
| 7337526 | 四半期報告書-第56期第3四半期(2024/01/01-2024/03/31) | 2024-05-15 | Japanese | ||
| 7352012 | 確認書 | 2024-02-14 | Japanese | ||
| 7351973 | 四半期報告書-第56期第2四半期(2023/10/01-2023/12/31) | 2024-02-14 | Japanese | ||
|
2023
2 filings
| |||||
| 7365877 | 臨時報告書 | 2023-12-01 | Japanese | ||
| 7373087 | 確認書 | 2023-11-14 | Japanese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Ambiq Micro, Inc.
Develops ultra-low power semiconductors for battery-powered…
|
AMBQ | US | Manufacturing |
|
American Aires Inc.
Develops patented nanotechnology solutions for neutralizing…
|
WIFI | CA | Manufacturing |
|
AMKOR TECHNOLOGY, INC.
A leading provider of outsourced semiconductor assembly and…
|
AMKR | US | Manufacturing |
|
Amlogic (Shanghai) Co.,Ltd.
Global fabless semiconductor company specializing in multim…
|
688099 | CN | Manufacturing |
|
Amosense Co., Ltd.
Develops electronic components, modules, and IoT devices us…
|
357580 | KR | Manufacturing |
|
Amotech Co., Ltd.
Manufacturer of electronic components based on advanced mat…
|
052710 | KR | Manufacturing |
|
AMPHENOL CORP /DE/
Global designer and manufacturer of interconnect products, …
|
APH | US | Manufacturing |
|
AMS OSRAM AG
A global leader in optical solutions for sensing, illuminat…
|
AMS | AT | Manufacturing |
|
ANALOG DEVICES INC
Designs and manufactures high-performance analog, mixed-sig…
|
ADI | US | Manufacturing |
|
Anapass, Inc.
A fabless semiconductor company that designs System-on-Chip…
|
123860 | KR | Manufacturing |
TECNISCO, LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/14620/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=14620 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=14620 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=14620 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 14620}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TECNISCO, LTD. (id: 14620)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.