TECNISCO, LTD.
Manufactures high-precision components from glass, metal & ceramics for high-tech industries.
2962 | T
Overview
Corporate Details
- ISIN(s):
- JP3545300000
- LEI:
- Country:
- Japan
- Address:
- 品川区南品川二丁目２番１５号
- Website:
- https://www.tecnisco.com/en.html
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
TECNISCO, LTD. is a specialized manufacturer and processing service provider of high-precision components. Established in 1970, the company leverages its proprietary "Cross-edge" technology, an integrated process combining advanced cutting, grinding, polishing, metalizing, and bonding techniques. It produces customized parts from materials such as glass, metal, ceramics, and silicon. Key products include metal heatsinks for optical communication and power semiconductors, structured glass wafers for MEMS devices and sensors, microfluidic components, and precision drilling tools. TECNISCO serves a diverse range of high-tech industries, including optoelectronics, semiconductors, industrial lasers, biotechnology, and medical equipment.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-09-26 09:21 |
Regulatory News Service
確認書
|
Japanese | 8.2 KB | ||
| 2025-09-26 09:20 |
Annual Report
有価証券報告書－第57期(2024/07/01－2025/06/30)
|
Japanese | 2.0 MB | ||
| 2025-06-25 06:22 |
Capital/Financing Update
臨時報告書
|
Japanese | 18.6 KB | ||
| 2025-02-14 07:35 |
Report Publication Announcement
確認書
|
Japanese | 8.1 KB | ||
| 2025-02-14 07:35 |
Interim Report
半期報告書－第57期(2024/07/01－2025/06/30)
|
Japanese | 159.9 KB | ||
| 2024-09-30 04:25 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 22.1 KB | ||
| 2024-09-27 07:18 |
Governance Information
内部統制報告書－第56期(2023/07/01－2024/06/30)
|
Japanese | 22.0 KB | ||
| 2024-09-27 07:15 |
Annual Report
有価証券報告書－第56期(2023/07/01－2024/06/30)
|
Japanese | 1.9 MB | ||
| 2024-09-27 07:15 |
Registration Form
確認書
|
Japanese | 8.2 KB | ||
| 2024-05-15 09:31 |
Report Publication Announcement
確認書
|
Japanese | 8.2 KB | ||
| 2024-05-15 09:30 |
Quarterly Report
四半期報告書－第56期第3四半期(2024/01/01－2024/03/31)
|
Japanese | 130.3 KB | ||
| 2024-02-14 07:31 |
Report Publication Announcement
確認書
|
Japanese | 8.1 KB | ||
| 2024-02-14 07:30 |
Quarterly Report
四半期報告書－第56期第2四半期(2023/10/01－2023/12/31)
|
Japanese | 146.5 KB | ||
| 2023-12-01 05:20 |
Audit Report / Information
臨時報告書
|
Japanese | 18.8 KB | ||
| 2023-11-14 07:36 |
Registration Form
確認書
|
Japanese | 8.1 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
