
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第四届董事会薪酬与考核委员会关于公司A股限制性股票激励计划(第二期)的审核意见 | 2025-12-12 | Chinese | |
| 关于对外担保的进展公告 | 2025-11-21 | Chinese | |
| 关于参加2025年度深圳辖区上市公司集体接待日活动的公告 | 2025-11-14 | Chinese | |
| 关于公司董事、总经理辞职暨聘任总经理并提名非独立董事候选人的公告 | 2025-10-29 | Chinese | |
| 第四届董事会第九次会议决议公告 | 2025-10-29 | Chinese | |
| 2025年三季度报告 | 2025-10-29 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 36790312 | 第四届董事会薪酬与考核委员会关于公司A股限制性股票激励计划(第二期)的审核意见 | 2025-12-12 | Chinese | ||
| 36790303 | 关于对外担保的进展公告 | 2025-11-21 | Chinese | ||
| 36790298 | 关于参加2025年度深圳辖区上市公司集体接待日活动的公告 | 2025-11-14 | Chinese | ||
| 36790287 | 关于公司董事、总经理辞职暨聘任总经理并提名非独立董事候选人的公告 | 2025-10-29 | Chinese | ||
| 36790278 | 第四届董事会第九次会议决议公告 | 2025-10-29 | Chinese | ||
| 36790269 | 2025年三季度报告 | 2025-10-29 | Chinese | ||
| 36790256 | 股票交易异常波动公告 | 2025-08-31 | Chinese | ||
| 36790249 | 第四届董事会第八次会议决议公告 | 2025-08-27 | Chinese | ||
| 36790239 | 2025年半年度报告 | 2025-08-27 | Chinese | ||
| 36790236 | 关于计提资产减值准备的公告 | 2025-08-27 | Chinese | ||
| 36790229 | 2025年半年度募集资金存放与使用情况的专项报告 | 2025-08-27 | Chinese | ||
| 36790219 | 2025年半年度财务报告 | 2025-08-27 | Chinese | ||
| 36790197 | 2025年半年度报告摘要 | 2025-08-27 | Chinese | ||
| 36790193 | 半年度非经营性资金占用及其他关联资金往来情况汇总表 | 2025-08-27 | Chinese | ||
| 36790186 | 关于与中航工业集团财务有限责任公司关联存贷款的风险持续评估报告 | 2025-08-27 | Chinese | ||
Market data
Market data not available
Price history
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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