
Shennan Circuits Co., Ltd. — Investor Relations & Filings
Shennan Circuits Co., Ltd. specializes in the research, development, and manufacturing of high-end printed circuit boards (PCBs), integrated circuit (IC) packaging substrates, and electronic assembly services. The company provides comprehensive solutions focusing on high-density interconnect (HDI) boards, multilayer PCBs, and rigid-flex technologies. Its product portfolio serves critical sectors including telecommunications, medical equipment, aerospace, and automotive systems. Shennan Circuits is recognized for its advanced manufacturing capabilities in 5G infrastructure components and high-performance computing hardware. By integrating design, fabrication, and assembly, the company offers end-to-end technical support and high-reliability products to global technology leaders.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于收到中国银行间市场交易商协会《接受注册通知书》的公告 | 2022-08-04 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2022-07-22 | Chinese | |
| 关于使用部分闲置募集资金进行现金管理的进展公告 | 2022-06-22 | Chinese | |
| 关于开立闲置募集资金现金管理专用结算账户的公告 | 2022-06-15 | Chinese | |
| 关于对外担保的进展公告 | 2022-06-15 | Chinese | |
| 关于股东减持计划实施进展的公告 | 2022-06-15 | Chinese |
Browse filings by year
10 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2022
15 filings
| |||||
| 36783185 | 关于收到中国银行间市场交易商协会《接受注册通知书》的公告 | 2022-08-04 | Chinese | ||
| 36783176 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2022-07-22 | Chinese | ||
| 36783166 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2022-06-22 | Chinese | ||
| 36783153 | 关于开立闲置募集资金现金管理专用结算账户的公告 | 2022-06-15 | Chinese | ||
| 36783142 | 关于对外担保的进展公告 | 2022-06-15 | Chinese | ||
| 36783133 | 关于股东减持计划实施进展的公告 | 2022-06-15 | Chinese | ||
| 36783124 | 关于注销部分募集资金账户的公告 | 2022-06-15 | Chinese | ||
| 36783111 | 2022年第一次临时股东大会决议公告 | 2022-06-07 | Chinese | ||
| 36783101 | 2022年第一次临时股东大会的法律意见书 | 2022-06-07 | Chinese | ||
| 36783087 | 关于使用部分闲置募集资金进行现金管理的进展公告 | 2022-05-30 | Chinese | ||
| 36783075 | 公司章程修订对照表 | 2022-05-20 | Chinese | ||
| 36783064 | 关于召开2022年第一次临时股东大会的通知 | 2022-05-20 | Chinese | ||
| 36783055 | 关于为子公司提供担保的公告 | 2022-05-20 | Chinese | ||
| 36783044 | 募集资金管理制度(2022年5月) | 2022-05-20 | Chinese | ||
| 36783033 | 公司章程(2022年5月) | 2022-05-20 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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ACES
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Shennan Circuits Co., Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54911/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54911 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54911 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54911 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54911}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Shennan Circuits Co., Ltd. (id: 54911)"
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