SCREEN Holdings Co., Ltd. Logo

SCREEN Holdings Co., Ltd.

Develops production equipment for semiconductors, graphic arts, and flat-panel displays.

7735 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
京都市上京区堀川通寺之内上る4丁目天神北町1番地の1
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

SCREEN Holdings Co., Ltd. is a developer and manufacturer of production equipment for high-tech industries. The company's primary business segment is Semiconductor Solutions, which provides essential manufacturing systems for wafer cleaning, coating, developing, and inspection. Leveraging its core competencies in precision, optical, and coating technologies, SCREEN also serves the graphic arts market with advanced digital printing equipment. Additional business areas include the development and sale of manufacturing and deposition equipment for flat-panel displays and printed circuit boards, alongside related support and services.

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Filings

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Date Filing Language Size Actions
2025-07-25 08:33
Registration Form
訂正発行登録書
Japanese 9.0 KB
2025-06-23 04:14
Regulatory News Service
訂正発行登録書
Japanese 9.0 KB
2025-06-23 04:06
Post-Annual General Meeting Information
臨時報告書
Japanese 24.5 KB
2025-06-19 08:20
Governance Information
内部統制報告書-第84期(2024/04/01-2025/03/31)
Japanese 24.1 KB
2025-06-19 08:11
Registration Form
確認書
Japanese 8.3 KB
2025-06-19 08:09
Annual Report
有価証券報告書-第84期(2024/04/01-2025/03/31)
Japanese 2.7 MB
2025-05-12 04:03
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.5 KB
2025-04-09 04:01
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 23.3 KB
2025-03-11 03:11
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.6 KB
2025-01-14 06:24
Regulatory News Service
訂正発行登録書
Japanese 9.1 KB
2025-01-14 05:32
Report Publication Announcement
確認書
Japanese 8.2 KB
2025-01-14 05:30
Interim Report
半期報告書-第84期(2024/04/01-2025/03/31)
Japanese 232.0 KB
2024-06-24 06:24
Registration Form
訂正発行登録書
Japanese 9.0 KB
2024-06-24 06:17
Post-Annual General Meeting Information
臨時報告書
Japanese 25.9 KB
2024-06-24 06:07
Governance Information
内部統制報告書-第83期(2023/04/01-2024/03/31)
Japanese 23.1 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
DISCO CORPORATION Logo
Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.
Japan 6146
DIT Corp. Logo
Develops AI-powered inspection equipment for semiconductor & flat-panel display manufacturing.
South Korea 110990
Doosan Robotics Inc. Logo
Manufactures AI-powered collaborative robots (cobots) for manufacturing, logistics, and services.
South Korea 454910
Dürr AG Logo
Automated plant engineering & robotics for efficient automotive & industrial manufacturing.
Germany DUE
Global manufacturer of precision tire molds and manufacturing equipment for the tire industry.
South Korea 145210
Air pollution control tech reducing greenhouse gases for the semiconductor industry.
South Korea 383310
Develops water-free robotic cleaning solutions for utility-scale solar sites.
Israel ECPA-M
Eles Logo
Provides reliability test solutions for zero-defect semiconductors in mission-critical sectors.
Italy ELES
ENBIOCO., LTD. Logo
Develops self-contained wastewater recycling systems for homes, agriculture, and industry.
South Korea 352940
ENJET Co.,LTD Logo
EHD inkjet printers for high-res patterning in displays, semiconductors, & camera modules.
South Korea 419080

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