
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于变更投资者联系方式的公告 | 2019-08-29 | Chinese | |
| 关于召开2019年第四次临时股东大会的通知 | 2019-08-29 | Chinese | |
| 公司章程(2019年8月) | 2019-08-29 | Chinese | |
| 关于变更注册资本并修订《公司章程》的公告 | 2019-08-29 | Chinese | |
| 关于会计政策变更的公告 | 2019-08-29 | Chinese | |
| 国信证券股份有限公司关于公司控股子公司使用部分募集资金开立银行承兑汇票、信用证、保函等支付募投项目相关款项的核查意见 | 2019-08-29 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2019
15 filings
| |||||
| 37269557 | 关于变更投资者联系方式的公告 | 2019-08-29 | Chinese | ||
| 37269551 | 关于召开2019年第四次临时股东大会的通知 | 2019-08-29 | Chinese | ||
| 37269541 | 公司章程(2019年8月) | 2019-08-29 | Chinese | ||
| 37269515 | 关于变更注册资本并修订《公司章程》的公告 | 2019-08-29 | Chinese | ||
| 37269506 | 关于会计政策变更的公告 | 2019-08-29 | Chinese | ||
| 37269497 | 国信证券股份有限公司关于公司控股子公司使用部分募集资金开立银行承兑汇票、信用证、保函等支付募投项目相关款项的核查意见 | 2019-08-29 | Chinese | ||
| 37269490 | 关于使用部分暂时闲置募集资金进行现金管理的进展公告 | 2019-08-29 | Chinese | ||
| 37269481 | 关于调整2017年限制性股票激励计划相关事项的公告 | 2019-08-29 | Chinese | ||
| 37269474 | 关于使用募集资金向控股子公司出资用于募集资金投资项目的公告 | 2019-08-29 | Chinese | ||
| 37269463 | 关于2019年半年度募集资金存放与使用情况的专项报告 | 2019-08-29 | Chinese | ||
| 37269446 | 第三届董事会第二十八次会议决议公告 | 2019-08-29 | Chinese | ||
| 37269439 | 2019年半年度报告 | 2019-08-29 | Chinese | ||
| 37269346 | 2019年半年度报告摘要 | 2019-08-29 | Chinese | ||
| 37269333 | 国信证券股份有限公司关于公司2019年上半年持续督导跟踪报告 | 2019-08-29 | Chinese | ||
| 37269322 | 北京市中伦律师事务所关于公司调整2017年限制性股票激励计划相关事项的法律意见书 | 2019-08-29 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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