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NEXCHIP SEMICONDUCTOR CORPORATION — Investor Relations & Filings

Ticker · 688249 ISIN · CNE1000060L1 Shanghai Stock Exchange Manufacturing
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Filings indexed 452 across all filing types
Latest filing 2023-04-11 Capital/Financing Update
Country CN China
Listing Shanghai Stock Exchange 688249

About NEXCHIP SEMICONDUCTOR CORPORATION

https://www.nexchip.com.cn

Nexchip Semiconductor Corporation is a specialized foundry focused on the research, development, and manufacturing of integrated circuits. The company primarily provides foundry services for display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), and microcontrollers (MCU). Utilizing mature process technologies ranging from 150nm to 55nm, Nexchip serves global clients in the consumer electronics, automotive, and industrial sectors. It is recognized as a leading provider in the display driver market, leveraging advanced manufacturing capabilities to support high-volume production of high-resolution display components. The company emphasizes technological innovation in wafer fabrication and assembly to meet the evolving demands of the global semiconductor supply chain.

Recent filings

Filing Released Lang Actions
晶合集成首次公开发行股票并在科创板上市招股意向书附录
Capital/Financing Update Classification · 95% confidence The document is a detailed issuance prospectus and sponsorship letter related to the initial public offering (IPO) and listing of Hefei Jinghe Integrated Circuit Co., Ltd. on the STAR Market (科创板). It includes extensive information about the company, its legal and financial status, internal controls, audit reports, and compliance with regulatory requirements. The document is not a simple announcement but a comprehensive filing related to the IPO process, including financial statements and audit reports as appendices. This type of document is best classified under Capital/Financing Update (CAP) because it pertains to the company's fundraising activity through an IPO and the associated regulatory filings and sponsorship documentation. It is not an Annual Report, Earnings Release, or other categories. The length and detail confirm it is not a mere announcement but a substantive financing document.
2023-04-11 Chinese
晶合集成首次公开发行股票并在科创板上市发行安排及初步询价公告
Capital/Financing Update Classification · 95% confidence The document is a detailed announcement regarding the initial public offering (IPO) of Hefei Jinghe Integrated Circuit Co., Ltd. on the STAR Market (科创板). It includes extensive information about the issuance arrangement, pricing, allocation, investor qualifications, regulatory approvals, and timelines related to the IPO process. The text references regulatory bodies such as the China Securities Regulatory Commission and Shanghai Stock Exchange, and discusses the offering size, pricing mechanism, strategic placement, and lock-up periods. This is not a financial report, earnings release, or management discussion, but rather a formal announcement of a capital raising event and stock issuance. Therefore, the document fits best into the category of Capital/Financing Update (CAP). The document length and detail confirm it is not a brief announcement or a report publication notice, but a substantive update on financing activities.
2023-04-11 Chinese

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