NEPES Corporation Logo

NEPES Corporation

An OSAT provider of turnkey advanced packaging solutions for fabless companies and IDMs.

033640 | KO

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
South Korea
Address:
충청북도 음성군 삼성면 금일로965번길 105, 음성군
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

NEPES Corporation, established in 1990, is a technology company focused on the semiconductor sector. As an Outsourced Semiconductor Assembly and Test (OSAT) provider, it delivers turnkey solutions in advanced packaging for fabless companies and Integrated Device Manufacturers (IDMs). NEPES specializes in core technologies such as flip-chip bumping, Wafer-Level Packaging (WLP), Fan-Out Wafer-Level Packaging (FOWLP), Panel-Level Packaging (PLP), and System-in-Package (SiP). The company also engages in the chemical and electronic materials businesses, aiming to provide hyper-connecting technologies for future applications.

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Filings

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Date Filing Language Size Actions
2025-08-14 00:00
Interim Report
반기보고서 (2025.06)
Korean 1.6 MB
2025-07-04 00:00
Regulatory News Service
[기재정정]신규시설투자등
Korean 10.8 KB
2025-06-16 00:00
Major Shareholding Notification
최대주주변경
Korean 27.0 KB
2025-06-16 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-06-16 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 110.4 KB
2025-06-16 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.9 KB
2025-06-16 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 103.1 KB
2025-05-16 00:00
Director's Dealing
임원ㆍ주요주주특정증권등거래계획보고서
Korean 42.0 KB
2025-05-16 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등거래계획보고서
Korean 42.7 KB
2025-05-16 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 105.3 KB
2025-05-15 00:00
Quarterly Report
분기보고서 (2025.03)
Korean 1.5 MB
2025-04-01 00:00
Regulatory News Service
신규시설투자등
Korean 7.3 KB
2025-03-28 00:00
Post-Annual General Meeting Information
정기주주총회결과
Korean 22.6 KB
2025-03-28 00:00
Board/Management Information
사외이사의선임ㆍ해임또는중도퇴임에관한신고
Korean 9.8 KB
2025-03-20 00:00
Audit Report / Information
감사보고서제출
Korean 24.8 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

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HIROSE ELECTRIC CO.,LTD. Logo
Global manufacturer of high-performance connectors for auto, mobile, & industrial markets.
Japan 6806
HLB innoVation Co.,Ltd. Logo
Manufactures semiconductor lead frames for global markets and develops biotech treatments.
South Korea 024850
Manufactures LED packages and modules for automotive and general lighting applications.
South Korea 036170

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