LB SEMICON, INC. — Investor Relations & Filings
LB SEMICON, INC. is an outsourced semiconductor assembly and test (OSAT) company specializing in the back-end processes of semiconductor manufacturing. The company's core services include flip-chip wafer bumping, wafer-level packaging (WLP), and testing solutions for semiconductor chips. A key area of focus is providing components for display equipment, such as gold bumping for TFT-LCD and OLED display driver integrated circuits (ICs). LB SEMICON was a pioneer in the commercialization of flip-chip wafer bumping technology in its domestic market and continues to advance its capabilities in areas like fan-out wafer-level packaging (FO-WLP).
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-30 | Korean | |
| 정기주주총회결과 | 2026-03-30 | Korean | |
| 대표이사변경 | 2026-03-30 | Korean | |
| 사업보고서 (2025.12) | 2026-03-20 | Korean | |
| 감사보고서제출 | 2026-03-20 | Korean | |
| 주주총회소집공고 | 2026-03-13 | Korean |
Browse filings by year
9 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
10 filings
| |||||
| 33085426 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-30 | Korean | ||
| 33084970 | 정기주주총회결과 | 2026-03-30 | Korean | ||
| 33084941 | 대표이사변경 | 2026-03-30 | Korean | ||
| 32996416 | 사업보고서 (2025.12) | 2026-03-20 | Korean | ||
| 32995910 | 감사보고서제출 | 2026-03-20 | Korean | ||
| 32939599 | 주주총회소집공고 | 2026-03-13 | Korean | ||
| 32826135 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 2026-02-23 | Korean | ||
| 32826073 | 주주총회소집결의 | 2026-02-23 | Korean | ||
| 32826029 | 주주총회집중일개최사유신고 | 2026-02-23 | Korean | ||
| 19474338 | 연결재무제표기준영업(잠정)실적(공정공시) | 2026-02-13 | Korean | ||
|
2025
5 filings
| |||||
| 12200476 | 주요사항보고서(자기주식처분결정) | 2025-12-24 | Korean | ||
| 33029558 | 주식등의대량보유상황보고서(약식) | 2025-11-03 | Korean | ||
| 33028375 | 증권발행결과(자율공시) | 2025-10-30 | Korean | ||
| 33025485 | 임시주주총회결과 | 2025-10-20 | Korean | ||
| 33025257 | 주요사항보고서(자본으로인정되는채무증권발행결정) | 2025-10-20 | Korean | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Beijing Relpow Technology Co., Ltd
Manufacturer of high-performance power modules for telecom …
|
300593 | CN | Manufacturing |
|
BEIJING YANDONG MICROELECTRONIC CO., LTD.
IDM specializing in integrated circuit design, wafer fabric…
|
688172 | CN | Manufacturing |
|
Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd.
Produces high-reliability MLCCs and EMI filters for aerospa…
|
603267 | CN | Manufacturing |
|
Beken Corporation
Fabless designer of wireless communication ICs for IoT and …
|
603068 | CN | Manufacturing |
|
BEL FUSE INC /NJ
Designs and manufactures products that power, protect, and …
|
BELFA | US | Manufacturing |
|
BENCHMARK ELECTRONICS INC
Provider of design, manufacturing, and lifecycle services f…
|
BHE | US | Manufacturing |
|
BenQ Materials Corporation
Global materials science leader in display materials, healt…
|
8215 | TW | Manufacturing |
|
Bestechnic (Shanghai) Co., Ltd.
Designs ultra-low power edge AIoT SoCs for audio and voice …
|
688608 | CN | Manufacturing |
|
Bestec Power Electronics Co., Ltd.
Designs and manufactures power conversion solutions and ele…
|
3308 | TW | Manufacturing |
|
BHCo.,Ltd.
Manufacturer of Flexible Printed Circuit Boards for consume…
|
090460 | KR | Manufacturing |
LB SEMICON, INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/15655/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=15655 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=15655 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=15655 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 15655}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for LB SEMICON, INC. (id: 15655)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.