LB SEMICON, INC. — Investor Relations & Filings
LB SEMICON, INC. is an outsourced semiconductor assembly and test (OSAT) company specializing in the back-end processes of semiconductor manufacturing. The company's core services include flip-chip wafer bumping, wafer-level packaging (WLP), and testing solutions for semiconductor chips. A key area of focus is providing components for display equipment, such as gold bumping for TFT-LCD and OLED display driver integrated circuits (ICs). LB SEMICON was a pioneer in the commercialization of flip-chip wafer bumping technology in its domestic market and continues to advance its capabilities in areas like fan-out wafer-level packaging (FO-WLP).
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 주식등의대량보유상황보고서(일반) | 2026-05-18 | Korean | |
| 주요사항보고서(유상증자결정) | 2026-05-15 | Korean | |
| 증권신고서(지분증권) | 2026-05-15 | Korean | |
| [첨부추가]분기보고서 (2026.03) | 2026-05-15 | Korean | |
| 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-30 | Korean | |
| 정기주주총회결과 | 2026-03-30 | Korean |
Browse filings by year
9 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
14 filings
| |||||
| 46382080 | 주식등의대량보유상황보고서(일반) | 2026-05-18 | Korean | ||
| 46357359 | 주요사항보고서(유상증자결정) | 2026-05-15 | Korean | ||
| 46355920 | 증권신고서(지분증권) | 2026-05-15 | Korean | ||
| 46351492 | [첨부추가]분기보고서 (2026.03) | 2026-05-15 | Korean | ||
| 33085426 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 2026-03-30 | Korean | ||
| 33084970 | 정기주주총회결과 | 2026-03-30 | Korean | ||
| 33084941 | 대표이사변경 | 2026-03-30 | Korean | ||
| 32996416 | 사업보고서 (2025.12) | 2026-03-20 | Korean | ||
| 32995910 | 감사보고서제출 | 2026-03-20 | Korean | ||
| 32939599 | 주주총회소집공고 | 2026-03-13 | Korean | ||
| 32826135 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 2026-02-23 | Korean | ||
| 32826073 | 주주총회소집결의 | 2026-02-23 | Korean | ||
| 32826029 | 주주총회집중일개최사유신고 | 2026-02-23 | Korean | ||
| 19474338 | 연결재무제표기준영업(잠정)실적(공정공시) | 2026-02-13 | Korean | ||
|
2025
1 filing
| |||||
| 12200476 | 주요사항보고서(자기주식처분결정) | 2025-12-24 | Korean | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
HSB
Manufactures customized multilayer PCBs for computing, netw…
|
5469 | TW | Manufacturing |
|
Hua Hong Semiconductor Limited
Global pure-play semiconductor foundry specializing in spec…
|
1347 | HK | Manufacturing |
|
HUA HONG SEMICONDUCTOR LIMITED
Global pure-play foundry specializing in 200mm and 300mm wa…
|
688347 | CN | Manufacturing |
|
HUA YING TECHNOLOGY (GROUP) CO.,LTD.
Produces TFT-LCD panels and display modules for mobile and …
|
000536 | CN | Manufacturing |
|
Hubei DOTI Micro Technology Co.,Ltd.
Provides semiconductor assembly, testing, and high-precisio…
|
301183 | CN | Manufacturing |
|
Huber+Suhner AG
Develops components for electrical and optical connectivity…
|
HUBN | CH | Manufacturing |
|
Huizhou China Eagle Electronic Technology Inc.
Develops and manufactures high-precision PCBs, HDI boards, …
|
002579 | CN | Manufacturing |
|
Hunan Aihua Group Co.,Ltd.
Manufacturer of aluminum electrolytic, polymer solid, and f…
|
603989 | CN | Manufacturing |
|
Hunan Goke Microelectronics Co., Ltd.
Designs high-performance ICs for video processing, SSD stor…
|
300672 | CN | Manufacturing |
|
Hunan Lead Power Technology Group Co., Ltd.
Develops and manufactures power electronics and energy conv…
|
300530 | CN | Manufacturing |
LB SEMICON, INC. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/15655/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=15655 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=15655 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=15655 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 15655}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for LB SEMICON, INC. (id: 15655)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.